Multilayer Ceramic Capacitor Chamfered Edge Adhesion
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Solution Overview
Problem
The miniaturization of multilayer ceramic electronic components leads to increased side gap regions, reducing the capacity of capacitors and potentially causing peeling issues due to insufficient adhesive strength between ceramic green sheets and the chip.
Innovation Solution
A method involving the formation of rounded chamfer portions and ceramic side surface layers to create a stronger adhesive bond, with the green ceramic material acting as 'putty' to fill interfaces, ensuring the ceramic side surface layers are not peeled off during the firing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the thickness of ceramic layers is decreased to increase capacity, then the number of ceramic layers to be laminated is increased, but the adhesive strength between ceramic green sheets becomes insufficient causing peeling
Solution Approach 1:
Rounded chamfer portions are formed on the green chip before forming the ceramic side surface layers. This preliminary shaping creates a geometric feature that interlocks with the ceramic side surface layers, providing mechanical support and preventing peeling before the firing process even begins.
Solution Approach 2:
Rounded chamfer portions with curved surfaces are formed at the ridgelines of the green chip. These curved surfaces provide a larger contact area and better mechanical interlocking with the ceramic side surface layers, enhancing adhesive strength and preventing peeling during and after firing.
2Volume of moving object
If miniaturization is performed, then the size of the component is reduced, but the ratio of side gap region area to internal electrode area increases, decreasing capacity
Solution Approach 1:
Ceramic side surface layers are added on the side surfaces of the green chip, utilizing the lateral dimension to provide adhesive support. This allows the internal electrodes to extend closer to the side surfaces without causing peeling, effectively reducing the side gap regions and increasing capacity in miniaturized components.
3Quantity of substance
If ceramic green sheets are adhered to side surfaces to form side gap regions, then miniaturization and increased capacity are achieved, but adhesive strength is insufficient causing peeling over time
Solution Approach 1:
Rounded chamfer portions are formed on the green chip before applying ceramic side surface layers. This preliminary geometric preparation creates mechanical interlocking features that remain effective after firing, ensuring long-term adhesive stability and preventing peeling.
Solution Approach 2:
The rounded chamfer portions with curved surfaces provide enhanced mechanical interlocking with the ceramic side surface layers. The curved geometry distributes stress more evenly and creates stronger bonds that resist peeling forces over time, improving reliability.
Data Source
AI summary
In a method of manufacturing a multilayer ceramic electronic component, polishing is performed so that intersection lines extending from external surfaces of a green element body and interfaces between a green chip to be formed into a laminate portion and ceramic side surface layers are each located within a curved-surface formation range of a chamfer portion. Accordingly, since a green ceramic material is extended so as to fill the interfaces like so-called “putty”, and the adhesive strength between the green chip to be formed into the laminate portion and each of the ceramic side surface layers is increased.