Ceramic Chip Firing Jig Layout to Prevent Shape Variation
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Solution Overview
Problem
The existing methods for manufacturing ceramic electronic components, such as multilayer ceramic capacitors, face issues with variations in characteristics and shapes due to placement on a sagger during firing, leading to defective products and reduced productivity, as well as mutual adhesion between sintered bodies.
Innovation Solution
A method involving the use of a jig with chip storing portions that support and store ceramic chip element assemblies independently, reducing variations in working conditions and preventing adhesion during the firing process, thereby improving the quality and productivity of ceramic electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple molded bodies are placed on a ceramic sagger for firing, then productivity is improved, but variations in characteristics and shapes occur between sintered bodies
Solution Approach 1:
The invention divides the firing process into individual slots within the sagger, where each molded body is placed in a separate compartment. This segmentation ensures that each sintered body is processed independently, preventing variations in characteristics and shapes while maintaining high productivity through batch processing of multiple bodies simultaneously.
2Productivity
If multiple molded bodies are placed on a ceramic sagger for firing, then productivity is improved, but mutual adhesion between sintered bodies occurs
Solution Approach 1:
The sagger is designed with separate compartments or slots that physically isolate each molded body during firing. This segmentation prevents mutual adhesion between adjacent sintered bodies while allowing simultaneous processing of multiple bodies, thereby maintaining high productivity without compromising reliability.
3Manufacturing precision
If a jig with chip storing portions is used to support ceramic chip element assemblies independently, then variations in quality are reduced, but device complexity increases
Solution Approach 1:
The jig with chip storing portions is designed to perform multiple functions: it supports individual ceramic chip element assemblies during firing, maintains their positions to prevent variations in quality, and can accommodate multiple assemblies simultaneously. This multi-functionality reduces quality variations without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces variations in the quality and shape of ceramic electronic components, minimizes adhesion between assemblies, and enhances productivity by ensuring consistent processing conditions and preventing collisions during the firing step.
Implementation Method 1
a jig preparation step of preparing a jig including a plurality of chip storing portions including a bottom portion to support a ceramic chip element assembly from below and an open-top side wall portion
Implementation Method 2
a step of obtaining a sintered body by firing the molded body
Data Source
AI summary
A method for manufacturing a ceramic electronic component includes a ceramic chip element assembly production step of producing ceramic chip element assemblies, a jig preparation step of preparing a jig with chip storing portions including a bottom portion to support a ceramic chip element assembly from below and an open-top side wall portion, a ceramic chip element assembly storing step of storing the ceramic chip element assemblies in the chip storing portions in a one-to-one correspondence, a ceramic chip element assembly working step of working the ceramic chip element assemblies stored in the chip storing portions, and a ceramic chip element assembly removal step of removing the ceramic chip element assemblies from the chip storing portions.