Ceramic Substrate Columnar Conductor Bonding with Recessed Interface

The patent applies preliminary action by forming a recess in the columnar conductor before final bonding operations. This recess is created during the formation process itself, allowing subsequent bonding surfaces to have increased area without requiring additional shrinkage from the conductive paste. The recess is formed as part of the columnar conductor structure before the final bonding step, enabling enhanced bonding area to be prepared in advance.

The patent applies dimensionality change by transitioning from a flat bonding interface to a three-dimensional recess structure in the columnar conductor. The recess creates additional bonding area by extending into the vertical dimension, effectively increasing the bonding interface from a two-dimensional surface to a three-dimensional structure with multiple contact points and increased surface area.

The recess is formed as a preliminary feature during the columnar conductor formation process, before the resin sealing operation. This preliminary recess structure is prepared in advance to provide enhanced bonding area that can withstand the forces applied during subsequent resin sealing without causing detachment.

The recess structure acts as a cushioning feature that distributes bonding stresses over a larger area. By creating this recess beforehand, the bonding interface is reinforced to better withstand the mechanical stresses during resin sealing, preventing detachment while allowing effective sealing to proceed.