Multilayer Circuit Manufacture TRIZ Cases

Concave insulator recesses at coplanar-to-pseudo-coaxial junctions cut capacitance mismatch, reducing RF reflection and signal leakage.

Laser-formed fracture lines in a glass carrier enable clean thin wiring separation at high speed while avoiding cracks, chipping, and contamination.

Embedded PCB windings, passives, and power devices shrink EV wireless charging rectifier thickness while improving thermal dissipation.

Alternating metal portions and signal vias confine high-frequency signals, cutting loss while enabling tighter line spacing for multi-element antennas.

Pre-stacked outer layers and a cylindrical conductor hole maintain precise conductor spacing for stable high-frequency transmission.

Peeling only the release layer improves cover lay alignment on long FPCs, enabling accurate terminal exposure with fewer handling defects.

A raised wiring layer helps conductive paste contact first during temporary fixing, reducing adhesive interference and improving embedded board connections.

A recessed conductor end and matching raised ceramic surface increase bonding area, helping columnar conductors resist detachment during resin sealing.

An insulating coat marks the cut while internal traces detour around the groove, reducing conduction failures and short-circuit risk.

A slide-based platform uses telescopic positioning pins and thin DC drives to separate clean and PP-processing areas.