Multilayer Circuit Manufacture TRIZ Cases

Concave insulator recesses at coplanar-to-pseudo-coaxial junctions cut capacitance mismatch, reducing RF reflection and signal leakage.

Laser-formed fracture lines in a glass carrier enable clean thin wiring separation at high speed while avoiding cracks, chipping, and contamination.

Embedded PCB windings, passives, and power devices shrink EV wireless charging rectifier thickness while improving thermal dissipation.

Alternating metal portions and signal vias confine high-frequency signals, cutting loss while enabling tighter line spacing for multi-element antennas.

Pre-stacked outer layers and a cylindrical conductor hole maintain precise conductor spacing for stable high-frequency transmission.

Peeling only the release layer improves cover lay alignment on long FPCs, enabling accurate terminal exposure with fewer handling defects.

A raised wiring layer helps conductive paste contact first during temporary fixing, reducing adhesive interference and improving embedded board connections.

A recessed conductor end and matching raised ceramic surface increase bonding area, helping columnar conductors resist detachment during resin sealing.

An insulating coat marks the cut while internal traces detour around the groove, reducing conduction failures and short-circuit risk.

A slide-based platform uses telescopic positioning pins and thin DC drives to separate clean and PP-processing areas.

Ceramic rigidity meets copper-foil conduction to reduce wiring resistance.

An insulated thermally conductive structure absorbs and disperses heat from high-performance processors while maintaining signal insulation.

A multilayer printed wiring board manufacturing method uses a thicker carrier foil to retain the heat-resistant metal layer during separation.

An alignment assembly guides an elliptical patch antenna into a waveguide, reducing manual precision requirements while maintaining coupling efficiency.

Additive electroplating fills through holes with void-free copper, resolving reliability failures from migration while enabling fine line spacing.

A peelable carrier film supports insulation substrates during cavity cutting and stacking to prevent undulation.

Machining an intermediate insulating layer on a packaging substrate bottom board to enable local staggered-layer wiring.

Thicker extended landing pads shorten blind via apertures, reducing upper surface taper to enable smaller feature sizes.

An insulating material layer separates the laser resisting layer from the core, resolving layout flexibility constraints during laser ablation.

Parallel stacked structures resolve the trade-off between miniaturization and impedance matching in amplifier chains.

An aluminum plate with recesses guides plastic film deformation during pressing, preventing glass fiber exposure and improving adhesion reliability.

Laser-activated catalyst enables electro-less copper plating in PCB blind vias, eliminating large alignment openings to increase distribution density.

Angled rigid printed circuit board sections within a single-chamber housing provide spatial separation of electronics and connecting regions.

Two-stage electrolytic filling plating suppresses voids caused by metal foil overhangs, ensuring complete hole filling and reliable interlayer connections.

A thermosetting resin composition combines polyimide and epoxy resins to deliver flexible, heat-resistant cured materials.

A touch screen panel fabrication method consolidates sensing electrodes and peripheral wiring into a single transparent conductive layer.

A multilayer ceramic package integrates inkjet printed layers via a two-step firing process to establish precise dimensional accuracy.