Thin Wiring Member Transfer Using Laser-Fractured Glass Carriers
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Solution Overview
Problem
Conventional methods for manufacturing a redistribution layer face challenges in forming fine wiring due to substrate height variations, leading to issues like cracks, chipping, and contamination, which degrade the carrier strength and production efficiency.
Innovation Solution
A method involving laser dicing (stealth dicing) is used to form a fracture starting point in a second carrier, allowing it to be divided into multiple parts without causing cracks or chipping, while using a first carrier for support and peeling to prevent damage and enable reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing blade is used to cut the second glass carrier at high speed, then production efficiency is improved, but cracks and chipping occur in the carrier
Solution Approach 1:
The patent applies preliminary action by forming a fracture initiation line in the glass carrier before the actual cutting process. This is achieved by irradiating the glass carrier with a laser beam to create a modified region that serves as a starting point for controlled fracture. By preparing this initiation line in advance, the subsequent cutting process can proceed at high speed without causing uncontrolled cracks or chipping, thus resolving the contradiction between production efficiency and carrier strength.
Solution Approach 2:
The patent replaces the traditional mechanical dicing blade cutting system with a laser-based fracture initiation system. Instead of directly using mechanical force to cut the glass carrier (which causes cracks and chipping), the invention uses laser irradiation to create a controlled fracture initiation line, followed by mechanical expansion that propagates the fracture along the predetermined path. This substitution allows high-speed cutting while maintaining carrier integrity.
2Reliability
If the feeding speed is reduced to 1 mm/sec to prevent cracks and chipping, then carrier strength is maintained, but production efficiency significantly deteriorates
Solution Approach 1:
The patent resolves this contradiction by performing preliminary laser irradiation to create a fracture initiation line before the cutting process. This preliminary action prepares the glass carrier for high-speed cutting by providing a controlled starting point for fracture propagation, eliminating the need for slow feeding speeds and thereby maintaining both carrier strength and production efficiency.
Solution Approach 2:
The invention replaces the slow mechanical cutting process with a two-stage system: first, laser irradiation creates a fracture initiation line instantaneously, and second, mechanical expansion rapidly propagates the fracture along the predetermined path. This substitution eliminates the need for slow feeding speeds while preventing cracks and chipping, thus resolving the contradiction between reliability and productivity.
3Speed
If a dicing blade is used to cut the wiring layer, then cutting speed is improved, but contamination occurs in the wiring layer
Solution Approach 1:
The patent replaces the mechanical dicing blade cutting system with a laser-based cutting system for the wiring layer. The laser beam cuts the wiring layer without physical contact, thereby eliminating contamination that would otherwise be caused by mechanical blade contact. This substitution maintains high cutting speed while preventing contamination of the wiring layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach prevents contamination and maintains carrier strength, enabling high-speed production of thin wiring members with accurate cuts and reduced environmental impact.
Implementation Method 1
forming, with laser beam, a modification region to become a starting point of a fracture, in an internal region of the second carrier
Implementation Method 2
expanding the second carrier on which the modification region is formed along a planar direction to divide the second carrier into a plurality of carrier parts
Data Source
AI summary
A method for producing a thin wiring member is disclosed. The method includes forming a wiring layer on a first carrier, the wiring layer including a plurality of wiring parts, cutting the wiring layer such that each includes at least one wiring part of the plurality of wiring parts, attaching a second carrier to a second surface on opposite side of a first surface on which the first carrier is provided in the wiring layer, peeling the first carrier from the wiring layer, forming, with laser beam, a modification region to become a starting point of a fracture, in an internal region of the second carrier which corresponds to a site at which the wiring layer has been cut, and expanding the second carrier on which the modification region is formed along a planar direction to divide the second carrier into a plurality of carrier parts.