Thermosetting Resin Composition for Heat Resistance and Flexibility
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Solution Overview
Problem
Current resin compositions for heat-resistant coating and insulating materials lack satisfactory heat resistance, electrical properties, and flexibility, as well as adequate storage stability before curing, leading to issues such as signal delays and cross-talk in electronic equipment.
Innovation Solution
A thermosetting resin composition combining a polyimide resin with a residual phenol compound and an epoxy resin, featuring a urethane bond generated by a reaction between a phenolic hydroxyl group and an isocyanate group, which enhances heat resistance and storage stability while maintaining flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If epoxy resin composition containing polyfunctional phenol resin and epoxy resin with weight average molecular weight of 35,000 or more is used, then heat resistance is improved, but electrical properties and dimensional stability deteriorate
Solution Approach 1:
The invention changes the molecular weight parameter of the epoxy resin from high (35,000 or more) to low (less than 35,000), and optimizes the phenol resin structure to achieve both heat resistance and good electrical properties. This parameter change resolves the contradiction by finding an optimal point that satisfies multiple requirements simultaneously.
Solution Approach 2:
The invention creates a composite resin system combining low molecular weight epoxy resin with specifically structured phenol resin (containing s-triazine ring or carbonyl group). This composite approach allows the synergistic effects of different components to achieve both heat resistance and maintained electrical properties, overcoming the limitations of using high molecular weight epoxy resin alone.
2Shape
If polyimide resin composition with carboxyl group and linear hydrocarbon structure is used, then flexibility is improved, but heat resistance and dimensional stability deteriorate
Solution Approach 1:
The invention changes the chemical structure parameters of the polyimide resin by introducing specific functional groups (s-triazine ring, carbonyl group) and optimizing the molecular weight range. This structural modification allows the resin to maintain flexibility while achieving superior heat resistance and dimensional stability, resolving the contradiction between flexibility and thermal performance.
Solution Approach 2:
The invention introduces specific functional groups (s-triazine ring, carbonyl group) at key positions within the polyimide resin structure. These localized structural features provide both flexibility and heat resistance simultaneously, allowing different parts of the molecule to contribute different properties that resolve the contradiction.
3Speed
If signal speed and high frequency of electronic equipment are improved, then performance is enhanced, but transfer characteristics deteriorate due to cross-talk and transfer delays
Solution Approach 1:
The invention optimizes the dielectric properties of the resin by changing its chemical composition and molecular structure. The low molecular weight epoxy resin combined with specifically structured phenol resin achieves lower dielectric constant and loss tangent, which improves signal transfer characteristics and reduces cross-talk, allowing high-speed signals to be transmitted without degradation.
Solution Approach 2:
The invention converts the potential harm of high-frequency signals (which cause cross-talk and delays) into a benefit by designing a resin composition specifically optimized for high-frequency performance. The resin's molecular structure and dielectric properties are tailored to minimize signal degradation, turning the challenge of high-speed signaling into an opportunity to demonstrate superior electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides a cured material with excellent heat resistance, electrical properties, and flexibility, ensuring stable storage before curing and improved performance in heat-resistant coating and insulating applications.
Implementation Method 1
a urethane bond generated by a reaction between a phenolic hydroxyl group and an isocyanate group
Data Source
AI summary
The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provides a thermosetting resin composition containing a polyimide resin (C) which has a structure represented by the following general formula (1) and/or general formula (2), and an epoxy resin (B), wherein X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.