Multilayer Transmission Line Via Structure for Precise Layer Spacing

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Solution Overview

Problem

The existing multilayer transmission line substrates face challenges in accurately controlling the spacing between the outermost conductor layer and the second-outermost conductor layer, which affects the transmission characteristics of high-frequency signals and the operation performance of circuit elements, such as antennas, due to the use of prepreg as a dielectric layer.

Innovation Solution

A multilayer transmission line substrate is designed with n conductor layers stacked in a predetermined direction, including an inner layer part with a cylindrical conductor hole part and outer layer parts that have a conductor layer and an inner conductor layer separated by dielectric layers, allowing for precise maintenance of the outermost layer-to-conductor spacing by pre-stacking the outer layer parts with a dielectric layer and then placing them on the inner layer part.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If prepreg is used as a dielectric layer to stack conductor layers, then the manufacturing process is simplified and layers are easily bonded, but the spacing between the outermost conductor layer and the second-outermost conductor layer cannot be accurately controlled

Engineering Contradiction:

Improveease of layer stackingVSAvoidspacing control accuracy

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent divides the multilayer substrate into distinct sections: an inner layer part with ground planes and a conductor hole part, and outer layer parts with transmission lines. This segmentation allows different stacking methods to be applied to different sections - the inner layer part can use prepreg for easy manufacturing, while the outer layer parts use precise stacking to ensure accurate spacing control.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The outer layer parts are pre-stacked with dielectric layers and conductor layers in a predetermined sequence before being assembled with the inner layer part. This preliminary stacking action ensures that the spacing between the outermost conductor layer and the second-outermost conductor layer is accurately controlled from the beginning, rather than relying on post-processing adjustments.

Inventive Principle:

Principle #10Preliminary action

2Ease of manufacture

If the spacing between the outermost conductor layer and the second-outermost conductor layer is not accurately controlled, then the manufacturing process remains simple, but the transmission characteristics of high-frequency signals and the operation performance of circuit elements deteriorate

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidsignal transmission characteristics

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies different quality requirements to different parts of the substrate. The inner layer part prioritizes manufacturing simplicity and can use standard prepreg stacking, while the outer layer parts prioritize signal transmission reliability and use precise stacking methods with accurately controlled dielectric layer thicknesses to maintain proper spacing for high-frequency signal integrity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables accurate signal transmission through the conductor hole part between the two sides of the multilayer substrate, maintaining good high-frequency signal transmission characteristics and operation performance of circuit elements.

Implementation Method 1

an inner conductor layer as the conductor layer opposed to the conductor layer as the outermost layer with a dielectric layer in between

Methodology Applied

Scientific EffectDielectric insulation: Dielectric

Implementation Method 2

has a conductor part to electrically connect the ground planes together

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

configured to convert respective transmission modes of the transmission line and the conductor hole part to propagate power between the transmission line and the conductor hole part

Methodology Applied

Scientific EffectElectromagnetic mode conversion: Electromagnetic Induction

Data Source

PatentUS11742559B2Multilayer transmission line including first and second transmission lines on opposite surfaces of a multilayer substrate and which are electrically connected by a cylindrical conductor hole

Publication Date: 2023.08.29 DENSO CORP

AI summary

A multilayer transmission line includes a multilayer substrate. The multilayer substrate includes a plurality of conductor layers stacked in a predetermined direction with dielectric layers interposed therebetween. The conductor layers in an inner layer part include ground planes, respectively. The inner layer part includes a conductor hole part. The conductor hole part is provided penetrating the respective ground planes in the inner layer part in the predetermined direction. The conductor hole part includes a conductor part to electrically connect the ground planes together. The conductor layer in an outer layer part includes a transmission line and a conversion part. The outer layer part includes the conductor layer as the outermost layer and an inner conductor layer.