Ceramic-Resin Wiring Board for Low-Resistance Semiconductor Devices

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Solution Overview

Problem

Ceramic packages used for semiconductor elements in vehicles face high resistance issues due to conductor materials, necessitating a solution that reduces conductor resistance while maintaining high rigidity.

Innovation Solution

A wiring board comprising a ceramic layer and a base material wiring layer with copper foil conductors, where the ceramic layer provides rigidity and the organic resin layer reduces resistance, integrated with a heat dissipation mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If ceramic material is used for the package, then rigidity is improved, but conductor resistance increases

Engineering Contradiction:

ImproverigidityVSAvoidconductor resistance

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The package is divided into two functional layers: a ceramic layer for structural support and rigidity, and an organic resin layer for electrical conduction. This segmentation allows each layer to optimize its specific function without compromising the other, resolving the contradiction between rigidity and conductor resistance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention uses a composite structure combining ceramic and organic resin materials. The ceramic layer provides mechanical strength and rigidity, while the organic resin layer with copper foil conductors provides low resistance electrical pathways. This composite approach allows simultaneous achievement of both rigidity and low conductor resistance.

Inventive Principle:

Principle #40Composite materials

2Reliability

If copper foil conductors are used in the organic resin layer, then conductor resistance is reduced, but the overall structure becomes more complex

Engineering Contradiction:

Improveconductor resistanceVSAvoidstructure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The copper foil conductors are integrated directly into the organic resin layer during the same manufacturing process, merging the conduction function with the structural layer. This eliminates the need for separate conductor installation steps and reduces overall structural complexity while maintaining low resistance.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves reduced conductor resistance and enhanced heat dissipation, maintaining high rigidity and reducing the number of components, thus minimizing deformation and failure probability of semiconductor elements.

Implementation Method 1

a base material wiring layer (20) having an organic resin as a base material and including a wiring layer, and a conductive wiring line (311) made of copper foil

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a ceramic layer (100) made of a ceramic

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250221079A1Wiring board and semiconductor device

Publication Date: 2025.07.03 KYOCERA CORP

AI summary

A wiring board includes a layered body. The layered body includes at least one ceramic layer consisting of ceramics and at least one base material wiring layer. A base material wiring layer includes a base consisting of an organic resin, a wiring layer, and a conductive wiring line on a surface thereof on a side of the ceramic layer, the conductive wiring consisting of cupper foil.