Touch Screen Panel Fabrication Reducing Mask Processes
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current touch screen panel fabrication methods require multiple processes for forming sensing electrodes, peripheral wiring, and bridges, leading to increased costs and manufacturing time due to the need for separate mask processes.
Innovation Solution
The method involves forming the sensing electrode and peripheral wiring in the same process, and the pad unit and bridge in the same process, reducing the number of mask processes required, thereby simplifying the fabrication and decreasing production time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate mask processes are used for forming sensing electrodes, peripheral wiring, and bridges, then each component can be precisely formed, but the number of manufacturing processes increases leading to higher costs and longer production time
Solution Approach 1:
The patent combines the formation of sensing electrodes, peripheral wiring, and bridges into a single integrated transparent conductive layer that is patterned using one mask process. This merging of previously separate manufacturing steps reduces the total number of processes while maintaining the precision needed for each component's formation.
Solution Approach 2:
The transparent conductive layer serves multiple functions simultaneously - it forms the sensing electrodes, peripheral wiring, and bridges all in one layer. This multi-functional approach eliminates the need for separate layers and mask processes for each component, thereby reducing manufacturing complexity and production time.
2Ease of manufacture
If multiple mask processes are used for forming different components, then each component can be independently patterned, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the patterning of sensing electrodes, peripheral wiring, and bridges into a single mask process. The mask is designed with patterns for all three components, allowing them to be formed simultaneously in one step rather than requiring multiple separate mask processes.
Solution Approach 2:
While using a single mask process, the patent segments the transparent conductive layer into different functional regions (sensing electrodes, peripheral wiring, bridges) through selective etching or deposition. This allows independent patterning capability to be maintained through functional segmentation rather than process segmentation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the complexity and cost of touch screen panel production by consolidating processes, resulting in a more efficient manufacturing method that lowers the time and resources needed for each product unit.
Implementation Method 1
exposing the photoresist layer through a first mask and developing the photoresist layer to form a first photoresist pattern
Implementation Method 2
etching the metal layer by using the first photoresist pattern as a mask to form the pad metal layer, the wiring metal layer, a connection metal layer, and a sensing metal layer
Data Source
AI summary
A method for fabricating a touch screen panel includes forming a metal layer on a substrate, and patterning the metal layer to form a metal pattern including a pad metal layer, a wiring metal layer, a connection metal layer, and a sensing metal layer including metal lines having a mesh shape. The method also includes forming a first transparent conductive layer on the substrate, forming an insulation layer on the first transparent conductive layer, patterning the insulation layer to form a wiring insulation layer, a connection insulation layer, and a sensing insulation layer, patterning the first transparent conductive layer to form a peripheral wiring, a connector, and a sensing electrode; forming a second transparent conductive layer on the substrate including the peripheral wiring, the connector, and the sensing electrode; and patterning the second transparent conductive layer to form a pad area and a bridge.