Wiring Substrate Layout for Laser Groove Isolation
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Solution Overview
Problem
Existing methods for cutting the connection between a metal layer and a wiring trace in a wiring substrate can lead to unintended grooves in inner wiring layers, causing conduction failures and metal layer exposure, which increases the risk of short circuits.
Innovation Solution
The wiring substrate design includes an insulating coat layer as a mark for cutting, with internal wiring layers and metal layers positioned to avoid overlapping the groove area, and are located within 0.5 mm from the surface to prevent laser beam impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light beam is applied to the surface of the substrate to cut the metal layer and wiring trace for plating, then the metal layer and wiring trace are electrically isolated, but the light beam may reach the inner part of the substrate and form grooves in the wiring layer, causing conduction failure
Solution Approach 1:
An insulating coat layer is formed on the surface of the metal layer before the cutting process. This preliminary action creates a protective barrier that prevents the light beam from penetrating too deeply into the substrate, thereby avoiding unintended grooves in the wiring layer while still allowing effective cutting of the metal layer and wiring trace for plating.
2Productivity
If the light beam intensity is increased to ensure effective cutting, then the cutting efficiency is improved, but the groove becomes deeper and more likely to cut the wiring layer in the inner part of the substrate
Solution Approach 1:
The insulating coat layer serves as a cushioning layer that absorbs and limits the penetration depth of the light beam. This beforehand cushioning allows the use of higher light beam intensity for efficient cutting of the metal layer without risking damage to the wiring layer in the inner part of the substrate, as the insulating coat layer protects against excessive penetration.
3Manufacturing precision
If a groove is formed in the metal layer formed in the inner part of the substrate, then the metal layer is exposed to the surface, but this increases the likelihood of short circuits
Solution Approach 1:
The insulating coat layer acts as an intermediary between the groove and the wiring layer in the inner part of the substrate. Even if the groove is formed at the wrong position and exposes the metal layer, the insulating coat layer prevents direct contact between the exposed metal layer and the wiring layer, thereby eliminating the risk of short circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the likelihood of cutting internal wiring and metal layers, preventing conduction failures and short circuits by ensuring the layers detour around the groove area and using insulating coat layers as markers.
Implementation Method 1
an insulating coat layer which can serve as a mark for cutting is formed on a surface metal layer
Data Source
AI summary
A wiring substrate (1) includes an insulating substrate (11), a surface metal layer provided on a surface of the insulating substrate (11), and a wiring layer disposed in an inner part of the insulating substrate (11). The surface metal layer (for example, a lead wiring portion (52)) is divided by a groove (61). The wiring layer (for example, an internal wiring trace (32)) is disposed in such a manner that, as viewed from above, the wiring layer detours around a region where the groove (61) is formed so as not to overlap with the region where the groove (61) is formed.