Multilayer Ceramic Component Electrode Structure for Moisture Resistance
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Solution Overview
Problem
Existing multilayer ceramic electronic components face challenges in productivity due to complex production processes, moisture penetration issues, and reliability concerns, especially during miniaturization and high-temperature/high-pressure operations.
Innovation Solution
A multilayer ceramic electronic component design featuring a ceramic body with internal electrodes and dielectric layers, where lead electrodes are connected and covered with ceramic layers, and sintered simultaneously, reducing external exposure and simplifying the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If external electrodes are formed by applying paste and sintering or curing after the ceramic body is sintered, then external electrodes can be formed on the ceramic body, but productivity is lowered due to the complexity of the process steps
Solution Approach 1:
The patent merges the external electrode formation process with the ceramic body sintering process by forming the external electrode as an integrated part of the green body before sintering. This eliminates the need for separate paste application and post-sintering curing steps, thereby simplifying the manufacturing process and improving productivity.
Solution Approach 2:
The external electrode structure is prepared in advance as part of the green body formation process rather than being added after sintering. The lead electrodes and ceramic layers are arranged in the final configuration before the single sintering step, which simplifies the overall process and improves manufacturing efficiency.
2Volume of moving object
If the external electrodes are thinned for miniaturization and high capacitance, then the component size is reduced and capacitance is increased, but external moisture can easily penetrate thereinto
Solution Approach 1:
The patent uses a composite structure where the external electrode consists of a lead electrode covered by a ceramic layer. This composite design provides both electrical conductivity (from the lead electrode) and moisture barrier protection (from the ceramic layer), allowing thin electrodes to maintain high capacitance while resisting moisture penetration.
Solution Approach 2:
The ceramic layer is applied locally on the outer surface of the lead electrode, providing moisture resistance specifically where needed (at the interface with the external environment) while maintaining the thin profile of the electrode for miniaturization and high capacitance.
3Adaptability or versatility
If a plating layer is formed on the external electrode, then board mounting capability is improved, but defects in internal structure may be induced due to penetration of plating solution
Solution Approach 1:
The ceramic layer covering the lead electrode acts as a protective barrier that prevents plating solution from penetrating into the internal structure during the plating process. This composite structure maintains internal integrity while still allowing the external surface to be plated for board mounting capability.
Solution Approach 2:
The ceramic layer serves as an intermediary barrier between the plating solution and the internal electrode structure. It allows the plating process to proceed on the external surface for board mounting while preventing harmful plating solution penetration that would cause internal defects.
4Volume of moving object
If external electrodes are made thin for miniaturization, then component size is reduced, but mechanical strength decreases and moisture penetration increases
Solution Approach 1:
The external electrode is constructed as a composite of a lead electrode (for conductivity) covered by a ceramic layer (for mechanical strength and moisture resistance). This composite structure enables thin electrode design for miniaturization while maintaining adequate mechanical strength through the ceramic layer's inherent strength properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances moisture resistance, improves mechanical strength, and simplifies the production process, leading to a more reliable and miniaturized component with improved performance under high-temperature/high-pressure conditions.
Implementation Method 1
simultaneously sintering the body, the first conductive paste layer, the first ceramic paste layer, the second conductive paste layer, and the second ceramic paste layer
Data Source
AI summary
A multilayer ceramic electronic component includes a ceramic body including a laminate body including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and including a dielectric layer, and a first internal electrode and a second internal electrode stacked in the third direction with the dielectric layer interposed therebetween, a first and a second margin portion; a first connection portion and a second connection portion. The first connection portion includes a first lead electrode connected to the first internal electrode, and the second connection portion includes a second lead electrode connected to the second internal electrode.