Multilayer Ceramic Component Creeping Discharge Reduction
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Solution Overview
Problem
Existing multilayer ceramic electronic components face challenges with creeping discharge and heat generation at high voltages, particularly in high-voltage inverter circuits, where film capacitors are not suitable for surface-mounting and have high equivalent series resistance (ESR) and thermal resistance.
Innovation Solution
A multilayer ceramic electronic component design featuring a multilayer ceramic body with optimized inner and outer electrodes, metal terminals, and a cover material that reduces creeping discharge and heat generation by increasing the contact area between electrodes and improving thermal conductivity, allowing for surface-mounting without lead wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If film capacitors are used to increase creeping distance, then creeping discharge is reduced, but the component size cannot be reduced and lead terminals are required
Solution Approach 1:
The patent changes the geometric parameters of the multilayer ceramic component by optimizing the arrangement and extension of inner electrodes to form outer electrodes that creep along the side surfaces. This parameter optimization achieves sufficient creeping distance while maintaining a compact, leadless structure suitable for surface mounting.
Solution Approach 2:
The patent utilizes the side surfaces of the multilayer ceramic body as an additional dimensional path for the outer electrodes to creep, rather than only relying on end surface paths. This dimensional utilization increases the effective creeping distance without increasing the overall component footprint.
2Ease of operation
If metal terminals are provided to enable surface mounting, then ease of operation is improved, but equivalent series resistance and thermal resistance increase
Solution Approach 1:
The patent merges the functions of separate metal terminals with the multilayer ceramic body by having the inner electrodes extend directly to form outer electrodes on the side surfaces. This integration eliminates the need for separate metal terminal connections, reducing contact resistance and improving both electrical and thermal performance.
Solution Approach 2:
The patent extracts the metal terminal components from the design by using the ceramic body's own structure (extended inner electrodes forming outer electrodes) to provide the necessary electrical connection points for surface mounting, thereby eliminating the harmful resistance introduced by separate metal terminals.
3Ease of operation
If metal terminals are provided for connection, then ease of operation is improved, but heat generation increases
Solution Approach 1:
The patent merges the electrical connection function with the thermal conduction path by having the inner electrodes extend to form outer electrodes that are directly integrated with the ceramic body. This creates a continuous thermal path from the internal structure to the mounting surface, improving heat dissipation.
Solution Approach 2:
The patent uses the ceramic body itself as an intermediary thermal conduction medium between the internal electrode structure and the external mounting surface. The ceramic material serves as both the structural body and the thermal pathway, efficiently conducting heat away from the active components.
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.