Monolithic Ceramic Component Side Protection via Tumbling and Adhesion
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Solution Overview
Problem
Existing methods for manufacturing monolithic ceramic electronic components, such as capacitors, face challenges in reducing the dimensions of protective areas at the side without increasing the risk of short-circuiting, particularly as components become thinner and internal electrodes with different polarities are exposed, leading to handling difficulties and potential short failures.
Innovation Solution
A manufacturing method involving the preparation of a mother block with stacked ceramic green sheets and internal electrodes, cutting to form green chips or rod-shaped block bodies with exposed internal electrodes, tumbling to create open surfaces, and affixing a side surface ceramic green sheet to form a protective layer, followed by thermo-compression bonding at a controlled temperature to enhance adhesion and prevent deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the dimensions of the protective area at the side are reduced to increase effective area, then the capacitance increases, but the risk of short-circuiting between internal electrodes with different polarities increases
Solution Approach 1:
The patent applies preliminary action by forming the protective layer on the side surfaces of green chips before stacking them into a mother block. This pre-formed protective layer prevents short-circuiting between internal electrodes with different polarities that are exposed on the side surfaces, allowing the protective area dimensions to be reduced while maintaining reliability.
Solution Approach 2:
The patent uses a protective layer as an intermediary substance between internal electrodes with different polarities. This protective layer acts as a mediator that prevents direct contact and potential short-circuiting, enabling closer spacing of electrodes to increase effective area while maintaining electrical isolation.
2Ease of manufacture
If green chips are handled manually to affix protective layers, then the process is simple, but short-circuits occur between exposed internal electrodes
Solution Approach 1:
The patent applies self-service by using a self-adhesive protective layer that automatically bonds to the side surfaces of green chips without requiring manual handling or additional adhesives. The protective layer has adhesive properties that enable it to attach itself to the green chip surfaces, eliminating the need for complex manual operations while ensuring reliable coverage.
Solution Approach 2:
The patent changes the parameter of the protective layer by giving it adhesive properties. This parameter change allows the protective layer to bond automatically to the green chip surfaces, transforming the process from manual affixing to a self-bonding process that improves both ease of manufacture and reliability.
3Length of moving object
If the stacking ceramic green sheets are made thinner to reduce component size, then the overall dimension decreases, but the distance between internal electrodes becomes smaller increasing short-circuit risk
Solution Approach 1:
The patent uses the protective layer as an intermediary that maintains electrical isolation between internal electrodes even when the distance between them is reduced due to thinner green sheets. This mediator ensures that the reduced spacing does not compromise electrical isolation.
Solution Approach 2:
The patent applies preliminary action by forming the protective layer on side surfaces before stacking, ensuring that even when green sheets are made thinner and electrodes are closer together, the pre-formed protective layers maintain adequate electrical isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the risk of short-circuiting by ensuring uniform open surfaces and enhanced adhesion, allowing for the production of reliable monolithic ceramic electronic components with reduced protective area dimensions while maintaining component integrity.
Implementation Method 1
affixing a side surface ceramic green sheet to the cut side surface to form a raw ceramic protective layer
Implementation Method 2
firing the raw component body
Data Source
AI summary
In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.