Multilayer Ceramic Component Stress Dispersion via Organic Layer Delamination
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Solution Overview
Problem
Multilayer ceramic electronic components face reliability issues due to stress propagation from substrate warping, leading to cracks and deformations, which existing solutions fail to adequately prevent or suppress effectively.
Innovation Solution
A multilayer ceramic electronic component design featuring external electrodes with a conductive metal and glass base electrode layer, an organic silicon compound layer, and a plating layer, where the adhesion strength between the laminated body and the base electrode layer is higher than between the organic and plating layers, allowing controlled delamination to disperse stress and prevent cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external electrodes are joined to the principal surfaces of the ceramic body, then electrical connection is achieved, but stress propagates to the ceramic body causing cracks
Solution Approach 1:
The external electrode is divided into multiple layers (base electrode layer, organic layer, plating layer) with different functions. The base electrode layer provides electrical connection while the organic layer acts as a stress-absorbing buffer, segmenting the stress transmission path and preventing crack propagation to the ceramic body.
Solution Approach 2:
The organic layer serves as an intermediary between the base electrode layer and the plating layer. It has lower adhesion strength to both adjacent layers, creating a controlled weak interface that absorbs stress and prevents stress propagation to the ceramic body, thereby protecting against cracks.
2Strength
If the adhesion strength between organic layer and plating layer is high, then structural integrity is improved, but stress cannot be effectively dispersed
Solution Approach 1:
The adhesion strength parameter is deliberately optimized to be lower at specific interfaces (between organic layer and adjacent layers) compared to other interfaces. This parameter change creates controlled weak points that facilitate stress dispersion while maintaining overall structural integrity through the hierarchical layer structure.
3Ease of operation
If the external electrodes extend onto the principal surfaces, then electrical connection is achieved, but the ceramic body becomes susceptible to warping stress
Solution Approach 1:
The organic layer is applied beforehand as a protective cushion between the base electrode layer and the plating layer. This pre-established buffer layer absorbs warping stress before it can propagate to the ceramic body, while still allowing the external electrode to extend onto the principal surfaces for electrical connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces stress propagation, prevents cracks and deformations, and enhances the reliability of multilayer ceramic electronic components by ensuring controlled delamination between the base electrode and plating layers, thereby improving performance and reliability.
Implementation Method 1
a first organic layer including an organic silicon compound, disposed to cover the first base electrode layer
Data Source
AI summary
A multilayer ceramic electronic component includes a first organic layer that covers from a first base electrode layer to at least a portion of a surface of a laminated body, a second organic layer that covers from a second base electrode layer to at least a portion of the surface of the laminated body, a first plating layer that includes a leading end in contact with the first organic layer and that has an atomic concentration ratio of Si to Cu of about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the first organic layer, and a second plating layer that includes a leading end in contact with the second organic layer and that has an atomic concentration ratio of Si to Cu being about 1% or more and about 5% or less between a Cu concentration and an Si concentration at the surface of the second organic layer.