3D Ceramic-Copper Power Converter Packaging for Higher Power Density
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Solution Overview
Problem
The power density of electrical devices like power converters is limited by thermoelectrical loading and interconnection constraints, particularly due to the orthogonal thermal and current conduction paths and the two-dimensional configuration of components, which restricts the integration of components and leads to low power density.
Innovation Solution
A three-dimensional interconnection substrate using a multi-material printing process with ceramic and copper, allowing components to be stacked vertically and reducing the device width, while maintaining efficient heat dissipation through a ceramic insulator with good thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If components are arranged in a two-dimensional configuration on a planar base, then the device structure is simple and easy to manufacture, but the power density is low due to limited space utilization
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked configuration. Circuit elements are arranged in multiple layers vertically above a planar base, with interconnections extending through the thickness of the substrate. This dimensional change increases space utilization and power density while maintaining manufacturing feasibility through layer-by-layer construction processes.
2Temperature
If thermal conduction paths are made orthogonal to current conduction paths, then heat dissipation is improved, but the device width increases to accommodate separate thermal paths
Solution Approach 1:
The patent merges thermal and electrical conduction paths by implementing isotropic thermal conductivity within the interconnection structure. The same interconnection material and geometry that provide electrical connectivity also serve as thermal conduction paths, eliminating the need for separate orthogonal thermal paths and reducing device width.
Solution Approach 2:
The interconnection structure performs multiple functions simultaneously: it provides both electrical connectivity between circuit elements and thermal conduction for heat dissipation. This multi-functionality is achieved through isotropic thermal conductivity in the interconnection material, allowing heat to be conducted in any direction along the same paths used for current flow.
3Power
If more circuit elements are integrated to increase power density, then the device becomes more compact, but thermoelectrical loading limits are exceeded
Solution Approach 1:
The interconnection structure serves dual purposes of electrical current conduction and thermal heat dissipation through its isotropic thermal conductivity. This allows the same material pathways to handle both power delivery and heat removal, enabling higher power density integration without exceeding thermoelectrical loading limits.
Solution Approach 2:
The patent employs composite interconnection structures with isotropic thermal conductivity properties, combining materials or structures that provide both excellent electrical conductivity and uniform thermal conductivity in all directions. This composite approach enables effective heat dissipation alongside high current carrying capacity, supporting higher power density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances power density by reducing the device footprint and maintaining efficient heat transfer, achieving substantial space savings without compromising cooling capabilities.
Implementation Method 1
maintaining efficient heat dissipation through a ceramic insulator with good thermal conductivity
Implementation Method 2
an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process
Data Source
AI summary
A power converter includes an amplifier, an inductor, a capacitor, and an interconnection block formed of an insulating material having conductive material deposited thereon by a multi-material printing process. The interconnection block supports one of the inductor and the capacitor in a manner that the one the inductor and the capacitor is disposed vertically above an other of the inductor and the capacitor.