Multilayer Ceramic Component Corner Plate Structure for Moisture Resistance
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Solution Overview
Problem
Existing multilayer ceramic electronic components face issues with insufficient moisture resistance due to bonding failures at the corners and edges, leading to increased moisture ingress and reduced structural integrity.
Innovation Solution
Incorporating plates at the corners of the main surface protective layers, ensuring L1≥L2, where L1 is the length of the plates in the third direction and L2 is the length from the multilayer portion to the internal electrode layer, to distribute pressure evenly and enhance bonding, thereby reducing deformation and bonding failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional manufacturing methods are used without plates, then the manufacturing process is simpler, but moisture resistance and bonding strength at corners and edges are insufficient
Solution Approach 1:
The protective structure is segmented into multiple functional components: main surface protective layers for top/bottom surfaces, side protective layers for lateral surfaces, and corner/edge plates for reinforcement at critical junctions. This segmentation allows each component to be optimized for its specific protective function, with plates providing enhanced moisture resistance at corners and edges where bonding failures typically occur.
Solution Approach 2:
The invention employs composite protective structures combining different material layers and configurations. The plates are integrated with main surface protective layers and side protective layers to form a composite system that leverages the strengths of each component. This composite approach enhances overall bonding strength and moisture resistance without simply increasing the thickness of single layers.
2Strength
If pressure is applied during manufacturing, then bonding between layers is achieved, but non-uniform pressure distribution causes deformation and bonding failure at corners and edges
Solution Approach 1:
The plates are pre-positioned at corners and edges before the bonding process. This preliminary placement ensures that these critical areas are properly supported and positioned to receive uniform pressure distribution during subsequent bonding operations, preventing deformation and bonding failures at these vulnerable locations.
Solution Approach 2:
The plates provide localized reinforcement and pressure distribution at corners and edges, which have different mechanical requirements compared to flat surface areas. This local quality enhancement ensures that pressure is evenly distributed at these critical junctions, achieving uniform bonding strength without causing deformation that would occur with uniform pressure application across the entire structure.
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer portion including multiple internal electrode layers and multiple dielectric layers stacked in a first direction, a pair of main surface protective layers located on opposite main surfaces of the multilayer portion in the first direction, a pair of side protective layers located on opposite side surfaces of the multilayer portion and the main surface protective layers in a second direction, and a plate located adjacent to each of opposite ends of each of the main surface protective layers in a third direction, in which L1≥L2, where L1 is a length of the plate in the third direction, and L2 is a length in the third direction from one end face of the multilayer portion to an end of an internal electrode layer of the internal electrode layers extending from the other end face of the multilayer portion.