Multilayer Ceramic Electrode Structure for Lower Electric Field Concentration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional multilayer ceramic capacitors face challenges in reducing electric field concentration, which affects their reliability, and existing solutions that incorporate auxiliary electrodes compromise capacitance effectiveness.
Innovation Solution
The design incorporates a multilayer ceramic electronic component with internal conductive layers featuring holes of varying area equivalent diameters, where the cumulative distribution's 99% diameter (D99) is set to 8.0 μm or less, reducing electric field concentration while maintaining capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If auxiliary electrodes are added to reduce electric field concentration, then reliability improves, but device complexity increases
Solution Approach 1:
The invention extracts and eliminates the harmful factor (large holes with diameter ≥ 10 μm) from the internal electrode layers. By removing these defective holes that cause electric field concentration, the patent improves reliability without adding auxiliary electrodes or increasing device complexity. This directly resolves the contradiction by addressing the root cause rather than adding corrective components.
2Reliability
If holes in internal electrode layers are reduced in size, then electric field concentration decreases, but manufacturing precision requirements increase
Solution Approach 1:
The invention changes the critical parameter from hole diameter to area equivalent diameter D99, establishing a new specification threshold of 8.0 μm or less. This parameter transformation allows for a clear, measurable control standard that balances electric field concentration reduction with manufacturability. The D99 parameter provides a statistical approach to control hole size distribution without requiring extreme precision for every individual hole.
3Reliability
If strict hole size control is implemented, then reliability improves, but manufacturing difficulty increases
Solution Approach 1:
The patent transforms the manufacturing control approach by introducing the area equivalent diameter D99 parameter with a threshold of 8.0 μm or less. This statistical parameter allows manufacturers to control the overall hole size distribution rather than requiring precise control of every individual hole, significantly easing the manufacturing process while maintaining improved reliability.
Solution Approach 2:
The invention applies partial action by focusing control efforts on the most critical aspect: the area equivalent diameter D99. Rather than requiring perfect control of all hole parameters (size, shape, position, number), the patent identifies and controls only the D99 parameter, which is sufficient to prevent electric field concentration and ensure reliability without excessive manufacturing burden.
Data Source
AI summary
A multilayer ceramic electronic component includes a multilayer body including stacked ceramic layers, internal conductive layers stacked on the ceramic layers, first and second main surfaces opposing each other in a height direction, first and second side surfaces opposing each other in a width direction perpendicular or substantially perpendicular to the height direction, and first and second end surfaces opposing each other in a length direction perpendicular or substantially perpendicular to the height direction and the width direction, and external electrodes connected to the internal conductive layers. The internal conductive layers include holes having a different area equivalent diameter. When an area equivalent diameter in which a cumulative value in a cumulative distribution of area equivalent diameters of the holes in each of the internal conductive layers becomes about 99% is defined as an area equivalent diameter D99, the area equivalent diameter D99 is about 8.0 μm or less.