Ceramic Component Electrode Structure to Prevent Plating Peeling
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Solution Overview
Problem
The bonding force between the porous external electrode (base layer) and the plating layer in electronic components is insufficient, particularly when the components are downsized, leading to potential peeling of the metal layer.
Innovation Solution
An electronic component with a ceramic body and an external electrode featuring a base layer in contact with the ceramic body, where the base layer has pores communicating to the ceramic body interface, and a metal layer extending through these pores, with a void ratio of 1.5 vol% or less, is manufactured using a method involving a raw material composition containing a glass precursor, a metal salt, and an organic polymer, followed by heat treatment and electrolytic plating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a porous external electrode base layer is formed using conventional glass frit gasification methods, then the base layer can be created with pores for metal layer formation, but the bonding force between the base layer and plating layer becomes insufficient, causing metal layer peeling
Solution Approach 1:
The invention changes the chemical composition parameters of the base layer by replacing conventional glass frit with specific glass components (B2O3: 30-70 wt%, ZnO: 5-30 wt%, SiO2: 10-40 wt%) and controlling the firing temperature (900-1100°C) to create a base layer with improved chemical reactivity and bonding characteristics while maintaining the porous structure necessary for metal layer formation
Solution Approach 2:
The invention creates a composite base layer structure combining glass matrix with metal particles (Ag, Cu, or Ni) dispersed within the porous structure. This composite approach enhances the bonding force between the base layer and the plating layer by providing multiple bonding mechanisms including chemical bonding, mechanical interlocking, and metallurgical bonding through the metal particles
2Length of moving object
If the electronic component is downsized to reduce dimensions, then the component size is reduced for miniaturization, but the adhesion between the metal layer and base layer becomes insufficient, leading to peeling
Solution Approach 1:
The invention applies local quality enhancement by creating a base layer with non-uniform composition and structure - the glass component distribution and pore structure are optimized locally at the interface region between the base layer and metal layer to provide enhanced bonding strength specifically where needed, while maintaining overall component miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances the adhesion between the base layer and the metal layer, preventing peeling and ensuring strong bonding, even under thermal stress during soldering.
Implementation Method 1
performing a heat treatment to form a base layer for an external electrode in contact with the surface of the ceramic body
Implementation Method 2
performing a heat treatment to form a base layer for an external electrode in contact with the surface of the ceramic body, the base layer including an underlying metal and a glass
Implementation Method 3
the raw material composition containing a glass precursor, a metal salt, an organic polymer as a thickener
Implementation Method 4
performing a heat treatment to form a base layer for an external electrode in contact with the surface of the ceramic body
Implementation Method 5
forming a metal layer for the external electrode on a surface of the base layer by electrolytic plating
Data Source
AI summary
An electronic component that includes a ceramic body and an external electrode on a surface of the ceramic body. The external electrode includes a base layer in contact with the surface of the ceramic body; and a metal layer on a surface of the base layer, the base layer having a pore communicating from the surface of the base layer to an interface with the surface of the ceramic body, a part of the metal layer extends to the interface with the surface of the ceramic body through the pore, and a void ratio in the base layer is 1.5 vol % or less.