Ceramic Component Outer Electrode Layout for Short-Circuit Prevention
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge is to prevent short-circuiting between land electrodes on a mounting substrate during the mounting of ceramic electronic components, particularly due to rotational misalignment, while ensuring stable mounting and minimizing solder stress.
Innovation Solution
A ceramic electronic component design with extended outer electrodes that have a middle portion extending inwardly more than the side portions, ensuring a sufficient gap between electrodes and reducing the risk of short-circuiting, along with specific dimensions and configurations to maintain stability during mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the length of the outer electrode is elongated and capacitor size decreases, then mounting density increases, but rotational misalignment causes electrode to span gap between land electrodes and short-circuiting occurs
Solution Approach 1:
The outer electrode is designed with an asymmetric configuration where the width at the end face is greater than the width at the side face. This asymmetric shape allows the electrode to maintain sufficient interval with adjacent electrodes while accommodating rotational misalignment during mounting, preventing the electrode from spanning across land electrode gaps.
Solution Approach 2:
The outer electrode has different width dimensions at different locations: a larger width at the end face for reliable electrical connection and a smaller width at the side face for maintaining interval with adjacent electrodes. This local quality variation resolves the contradiction between ensuring good electrical contact and preventing short-circuiting during rotational misalignment.
2Reliability
If the interval between outer electrodes is increased to prevent short-circuiting, then reliability improves, but outer electrode length becomes short causing capacitor chip to stand on mounting substrate
Solution Approach 1:
The asymmetric width configuration of the outer electrode (larger at end face, smaller at side face) enables sufficient interval between adjacent electrodes to prevent short-circuiting, while the larger end face width provides adequate solder contact area to maintain mounting stability and prevent the capacitor chip from standing on the substrate.
Solution Approach 2:
The outer electrode concentrates its width dimension at the end face where it is needed for both electrical connection and mounting stability, while reducing width at the side face to maintain proper interval with adjacent electrodes. This local quality distribution simultaneously achieves short-circuit prevention and mounting stability.
Data Source
AI summary
A ceramic electronic component includes an element body having a first inner electrode exposed at a first end face of the element body, and a second inner electrode exposed at a second end face of the element body. The ceramic electronic component also includes a first outer electrode formed on the first end face and its neighboring faces of the element body. The first outer electrode includes two side portions and a middle portion on each of top and bottom faces of the element body such that the middle portion extends inwardly towards a center of the element body more than the two side portions from the first end face. The ceramic electronic component also includes a second outer electrode having the same dimensions as the first outer electrode on the second end face and its neighboring faces of the element body.