Ceramic-Embedded Wiring for Compact High-Density LED Layouts
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Solution Overview
Problem
Current light emitting devices have limitations in reducing their size due to the arrangement of wirings outside the substrate, which affects the density and efficiency of light emitting elements.
Innovation Solution
A light emitting device utilizing a ceramic substrate with integrated wirings that are electrically connected to the light emitting elements, allowing for a more compact design and direct power supply, while a buffer layer mitigates lattice mismatch issues between the substrate and semiconductor layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If wirings are arranged outside the substrate to electrically connect light emitting elements, then electrical connection is achieved, but the device size increases and element density decreases
Solution Approach 1:
The patent merges the wiring structure with the substrate by forming wirings inside the ceramic substrate through embedded electrodes and conductive pathways. This integration eliminates the need for separate external wiring arrangements, thereby reducing overall device size while maintaining electrical connection functionality between light emitting elements.
Solution Approach 2:
The patent transitions from a two-dimensional surface wiring arrangement to a three-dimensional internal wiring structure by embedding conductive pathways within the substrate thickness. This dimensional change allows electrical connections to be made through the substrate volume rather than along its surface, reducing the device footprint and increasing element density.
2Quantity of substance
If wirings are arranged outside the substrate, then electrical connection is achieved, but light emitting element density is reduced
Solution Approach 1:
By integrating the wiring system within the substrate structure, the patent enables closer spacing of light emitting elements without the need for external wiring clearance. This increases the quantity of light emitting elements per unit area while the internal wiring pathways maintain efficient power distribution to each element.
3Volume of moving object
If ceramic substrate with integrated wirings is used, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent employs preliminary actions by forming the wiring structure within the ceramic substrate during the substrate manufacturing process itself, before the light emitting elements are mounted. This includes creating embedded electrodes and conductive pathways in advance, which simplifies subsequent assembly steps and reduces overall manufacturing complexity despite the advanced substrate fabrication requirements.
Data Source
AI summary
A light emitting device includes a ceramic substrate, a light emitting element, and a wiring. The light emitting element is formed on an upper surface of the ceramic substrate. The wiring is arranged inside the ceramic substrate and is electrically and directly connected to the light emitting element. The light emitting element includes a structure in which a lower semiconductor layer, an active layer, and an upper semiconductor layer are sequentially stacked.