Ceramic Heater Terminal Rounded Surface Stress Reduction
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Solution Overview
Problem
Ceramic heaters in semiconductor processing systems are prone to cracking due to high temperatures and rapid thermal slew rates, limiting the deposition temperature and throughput, and requiring time-consuming material qualification and testing to prevent adverse effects on material layers.
Innovation Solution
A substrate support with a heater body made from ceramic material, featuring a heater element and terminal with a rounded surface embedded within the ceramic material to reduce stress, and connected to an electrode surface for efficient heat transfer, using materials like molybdenum or molybdenum alloys to match thermal expansion coefficients and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the deposition temperature is increased to improve throughput, then productivity is improved, but the ceramic heater material is subject to cracking
Solution Approach 1:
The patent changes the material parameter of the heater body from conventional ceramic materials to alumina ceramic material, which has superior crack resistance at high temperatures. This material parameter change enables the system to operate at higher deposition temperatures without experiencing heater cracking, thereby improving throughput while maintaining reliability.
Solution Approach 2:
The patent employs a composite structure consisting of an alumina ceramic heater body combined with a heating element. This composite material approach leverages the high-temperature stability and crack resistance of alumina ceramic while incorporating the heating functionality, enabling reliable operation at elevated deposition temperatures that improve productivity.
2Productivity
If the heating rate is increased to improve throughput, then productivity is improved, but the ceramic heater material is subject to cracking
Solution Approach 1:
The patent changes the material parameter of the heater body to alumina ceramic material, which has superior thermal shock resistance and crack resistance under rapid heating conditions. This enables the system to withstand higher heating rates without heater failure, thereby improving throughput while maintaining reliability during rapid thermal slew operations.
3Reliability
If the ceramic material composition is changed to improve cracking resistance, then reliability is improved, but time-consuming qualification and testing is required
Solution Approach 1:
The patent specifies alumina ceramic material with particular properties (high crack resistance, appropriate thermal expansion coefficient) as the heater body material. By defining specific material parameters upfront, the invention reduces the need for extensive qualification and testing of alternative materials, as alumina ceramic is a well-established material with known performance characteristics that meet the requirements for high-temperature, high-reliability operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively limits stress in the ceramic material, reducing the likelihood of cracking and prolonging the service life of the substrate support, allowing for higher temperature and faster material layer deposition processes without compromising the quality of deposited layers.
Implementation Method 1
The rounded surface of the heater terminal opposes the upper surface of the heater body and is embedded within the ceramic material to limit stress within the ceramic material during heating of a substrate seated on the upper surface of the heater body
Implementation Method 2
The heating element in generally arranged to communicate heat to one or more substrate supported on the ceramic heating element through the ceramic material forming the ceramic heater, the ceramic material relaying heat generated by the heating element to heat the substrate to the desired deposition temperature
Data Source
AI summary
A substrate support includes a heater body, a heater element, and a heater terminal. The heater body is formed from a ceramic material and has upper and lower surfaces separated by a thickness. The heater element is arranged between the upper and lower surfaces and is embedded within the ceramic material forming the heater body. The heater terminal is arranged between the upper and lower surfaces, is electrically connected to the heater element, and has an electrode surface and a rounded surface. The electrode surface opposes the lower surface to flow an electric current to the heater element. The rounded surface opposes the upper surface and is embedded within the ceramic material to limit stress within the ceramic material during heating of a substrate seated on the upper surface of the heater body. Semiconductor processing systems and methods of making substrate supports for semiconductor processing systems are also described.