Ceramic Thermal Insulation for Electronic Components
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Solution Overview
Problem
Electronic components are vulnerable to high temperatures during manufacturing processes like overmolding, which can damage them, and existing thermal insulation methods may not adequately protect against excessive heat exposure.
Innovation Solution
A method using ceramic thermal insulation material containing lithium molybdate (Li2MoO4) is applied to electronic components, which can be molded, dried at low temperatures, and optionally mixed with additives to enhance thermal protection, providing a heat-resistant barrier against high temperatures during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electronic components are covered with conventional thermal insulation material, then heat protection is improved, but the material requires high-temperature processing that damages the electronic component
Solution Approach 1:
The patent changes the processing temperature parameter from conventional high temperatures (required by traditional insulation materials) to low temperatures (below 150°C) by using a specially formulated ceramic paste containing organic vehicle that can be applied and cured at low temperatures, thus protecting heat-sensitive electronic components
Solution Approach 2:
The patent uses a composite material system consisting of ceramic particles (providing thermal insulation) suspended in an organic vehicle (enabling low-temperature application), creating a paste that combines the heat protection benefits of ceramics with the low-processing-temperature advantages of organic binders
2Object-affected harmful factors
If ceramic thermal insulation material is used, then thermal insulation performance is improved, but the material must be sintered at high temperatures which is incompatible with electronic components
Solution Approach 1:
The patent applies the ceramic paste to the electronic component before any high-temperature processing occurs, and the paste is then cured at low temperatures to form a protective coating, eliminating the need for subsequent high-temperature sintering that would damage the component
Solution Approach 2:
The patent replaces the traditional thermal sintering process (high-temperature mechanical/thermal treatment) with a low-temperature curing process using organic vehicles, substituting a harsh thermal field with a gentle chemical curing process that achieves similar structural consolidation without damaging electronic components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The ceramic insulation effectively protects electronic components from heat damage during processes like overmolding, maintaining their functionality and integrity by reducing thermal conductivity and preventing excessive heat exposure, while avoiding the need for high-temperature processing.
Implementation Method 1
ceramic thermal insulation material containing lithium molybdate Li2MoO4
Data Source
AI summary
A heat resistant electronic component is disclosed, comprising an electronic component covered by a layer of ceramic thermal insulation material containing lithium molybdate Li2MoO4. A process for manufacturing the heat resistant electronic component comprises obtaining ceramic thermal insulation material containing lithium molybdate Li2MoO4 in a mouldable form, optionally mixing the ceramic thermal insulation material with at least one additive, covering an electronic component with the material, shaping the material covering the electronic component into a desired form, and drying the desired form at a temperature of from 20° C. to 120° C.