Dielectric Materials TRIZ Cases

Inorganic glass flux enables liquid phase sintering to reduce porosity in dielectric layers without melting the metallic foil substrate.

Low oxygen permeation resin film and high thermal stability adhesive prevent oxidation degradation in silicon carbide power devices.

Glass ceramic layers within 100 μm of principal surfaces supply glass components to reduce thermal expansion coefficients in multilayer ceramic substrates.

Matching dielectric constants between quartz glass cloth and organic resin reduces transmission loss and skew in millimeter-wave communication substrates.

O2 plasma treatment removes resin smear from via drill holes before electrolytic plating, ensuring reliable conduction performance.

A phenoxy resin with cyclohexane and fluorene rings provides balanced heat resistance and adhesiveness for electronic applications.

A composite polyimide film uses fluorine polymer coated silica particles to lower dielectric constant and hygroscopicity.

Replacing polymer layers with ceramic or glass encapsulating members prevents melting during high temperature plasma processing.

Segmented conductive layers within a nested housing mitigate signal degradation and unintended voltage fluctuations during substrate deformation.

Modified polytetrafluoroethylene powder uses a core-shell structure to balance extrusion pressure and dielectric loss.

Segmented glass routing structures relax substrate density requirements, reducing manufacturing costs and enabling thinner substrates.

Combining alkyl phenol epoxy with benzoxazine resin reduces water absorption while maintaining flame retardancy.

Functionalized fluororesin bonds to thermoplastic resin via controlled heat lamination.

Inkjet printing on flexible substrates replaces complex photolithography, reducing manufacturing costs while maintaining high precision.

A polymer thick film silver conductor composition achieves low resistivity and adhesion at 80°C drying temperatures.

Resin coated copper insulating layers and a buffer layer reduce signal loss while maintaining adhesion between the circuit pattern and the substrate.

Semi-cured polyolefin resin layer controls fluidity during molding to prevent resin extrusion into holes while maintaining adhesiveness.

Segmented build-up structures on a flexible printed circuit board reduce signal loss in high-frequency mmWave communication systems.

Nanosized inorganic fillers enable a dielectric composite with stable signal transmission while avoiding voids from excessive filler loading.

Segmented insulation layers prevent cracking during dicing while maintaining electrical integrity for reliable light emission.

Asymmetric front electrode geometry minimizes overlap area with internal conductors to reduce parasitic capacitance in multilayer substrates.

Embed hard gold edge connectors within insulating layers to isolate them from ENEPIG baths, preventing organic contamination and reducing disposal costs.

A thermal neutron absorber layer absorbs thermal neutrons to prevent soft errors in integrated circuits.

Embeds discrete components in stacked substrates using high-transition bonding materials to withstand fusion temperatures and reduce parasitics.

Interlayer composition resolves adhesion and conductivity trade-off using polyvinyl butyral, poly(melamine-co-formaldehyde), and anhydride.

A halogen-free low dielectric resin composition combines polyphenylene ether with unsaturated cross-linking agents and specific phosphorus compounds.

Cold spray deposits a dielectric layer on PTFE to enable conductive circuit printing without surface etching or chemical modification.

A multi-layer insulation film uses heat-conduction plastics and conductive additives to achieve thermal conductivity and electromagnetic shielding.

Fluorinated vinyl polymer resin composition impregnates fiberglass substrates to form prepregs with high glass transition temperatures.

Firing a dielectric thick film creates a glass-ceramic composite layer that enhances thermal conductivity and mechanical strength for high-power LED modules.

Hexahydrotriazine compounds in a polymer binder scavenge hydrogen sulfide gas, preventing silver corrosion while maintaining electrical conductivity.

Segmented copper foil layers with controlled non-copper metal concentrations reduce electrical loss while maintaining bonding strength.

Longitudinally co-aligned continuous silica fibers in polymer matrix achieve dielectric loss tangent below 0.0015 at 15 GHz while maintaining flexural strength.

Surface segregation of functional compounds creates a concentrated layer that enhances peel strength without increasing the bulk dielectric loss tangent.

A solder layer bonds the LED heat slug to a dissipation plate, creating a direct thermal conduction path.

A long laminate uses a thin fluororesin layer to support high signal transmission speed while preventing wrinkles and maintaining dimensional stability.

Applying an anti-electroplate coating to via walls eliminates back-drilling costs and signal reflection from barrel stubs.

Silane-treated anisotropic filler in perfluorinated fluororesin reduces linear expansion coefficient while maintaining moldability.

Laser ablation forms channels in catalytic laminates to embed copper traces, eliminating void entrapment during prepreg lamination.

Low-temperature curing of lithium molybdate ceramic insulation protects sensitive electronics from overmolding heat without high-temperature sintering.

A metal-clad laminate structure combines fluoropolymer dielectric layers with reinforcing fabric to achieve high stiffness.

Laser ablation creates obtuse deep and horizontal shallow grooves in ceramic laminates, preventing plating film damage during valley folding.

A fluorine-containing adhesive layer joins an insulating film to a fluorinated liquid coating, preventing film lifting caused by weak van der Waals forces.

A transparent electrode composed of MXene and polyvinylpyrrolidone fills a patterned channel on a flexible substrate.

Composite reinforcement materials in insulative layers maintain core strength during thinning, preventing warpage from increased electrode density.

Porous inorganic fillers with low surface tension prevent treatment liquid permeation while maintaining mechanical strength and a low dielectric constant.

Vertical copper stacking increases trace capacity while maintaining fine line widths for high-density electronics.

Larger second interlayer connection conductor area prevents disconnection in multilayer boards by increasing contact surface for thermal pressure bonding.

Fluororesin coatings on nitride semiconductor bases prevent metal migration and short-circuits under ultraviolet light.