Dielectric Materials TRIZ Cases
- Glass Flux Sintering of Dielectric Thin Films
Inorganic glass flux enables liquid phase sintering to reduce porosity in dielectric layers without melting the metallic foil substrate.
- Adhesive Film Oxygen Barrier for SiC GaN FPC Heat Resistance
Low oxygen permeation resin film and high thermal stability adhesive prevent oxidation degradation in silicon carbide power devices.
- Multilayer Ceramic Substrate Shrinkage Control via Glass Ceramic Layers
Glass ceramic layers within 100 μm of principal surfaces supply glass components to reduce thermal expansion coefficients in multilayer ceramic substrates.
- Low Dielectric Substrate for Millimeter-Wave Signal Stability
Matching dielectric constants between quartz glass cloth and organic resin reduces transmission loss and skew in millimeter-wave communication substrates.
- Via Filling in Printed Wiring Boards Using O2 Plasma Desmearing
O2 plasma treatment removes resin smear from via drill holes before electrolytic plating, ensuring reliable conduction performance.