Fluororesin Thermoplastic Laminate Adhesion
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Solution Overview
Problem
Existing insulating substrates for printed circuit boards, particularly those using thermoplastic liquid crystal polymer films, face challenges with low dielectric constants and insufficient adhesive strength when combined with fluororesin films.
Innovation Solution
A laminate comprising a fluororesin layer with specific functional groups and a thermoplastic resin layer, where the thermoplastic resin has a higher melting point than the fluororesin, is directly laminated to enhance adhesive strength, and a method involving heat lamination at controlled temperatures and pressures is used to produce this laminate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fluororesin film and a thermoplastic resin film are laminated, then the dielectric properties are improved, but the adhesive strength between layers is insufficient
Solution Approach 1:
The patent modifies the chemical parameters of the fluororesin by introducing functional groups (carboxyl, hydroxyl, amine, or isocyanate groups) with specific content ratios (0.1-10 mmol/g for carboxyl/hydroxyl, 0.01-1 mmol/g for amine/isocyanate). This chemical parameter change enables the fluororesin to form strong chemical bonds with the thermoplastic resin layer, resolving the adhesion problem while maintaining dielectric properties.
Solution Approach 2:
The patent creates a composite material system where fluororesin with specific functional groups is combined with thermoplastic resin (polyester, polyamide, or liquid crystal polymer) in a laminated structure. The functional groups in the fluororesin layer form chemical bonds with the thermoplastic resin, creating a composite material with both excellent dielectric properties and strong interlayer adhesion.
2Temperature
If the melting point of thermoplastic resin is increased to improve heat resistance, then the processing temperature range becomes narrower
Solution Approach 1:
The patent carefully selects thermoplastic resins with melting points in specific ranges (polyester: 200-300°C, polyamide: 220-350°C, liquid crystal polymer: 280-380°C) and controls the functional group content in the fluororesin. This parameter optimization ensures the thermoplastic resin provides sufficient heat resistance while maintaining an adequate processing temperature window for lamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate achieves improved adhesive strength between the fluororesin and thermoplastic resin layers, resulting in enhanced electrical insulating properties and reliability for printed circuit boards.
Implementation Method 1
a method involving heat lamination at controlled temperatures and pressures is used to produce this laminate
Implementation Method 2
The laminate achieves improved adhesive strength between the fluororesin and thermoplastic resin layers
Implementation Method 3
the thermoplastic resin has a melting point higher by at least 5° C. than the melting point of the fluororesin
Data Source
AI summary
To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength.A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.