Glass Routing Structures for High Density Microelectronic Packaging
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Solution Overview
Problem
Current microelectronic packaging technologies face challenges in achieving high density trace routing, which increases costs and complicates the fabrication of thin trace routing substrates.
Innovation Solution
Incorporating a glass routing structure, either laminated or embedded, with high density through holes and conductive traces, allowing for reduced density requirements on the trace routing substrate and enabling the use of thinner substrates by forming a glass layer with conductive traces and vias that can be integrated with microelectronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If high density trace routing is implemented on the substrate, then routing capability is improved, but manufacturing cost increases and fabrication complexity increases
Solution Approach 1:
The patent segments the routing function by introducing a separate glass routing structure with through-holes that works in conjunction with the substrate trace routing. This division allows each component to have optimized density requirements, reducing the burden on the substrate while maintaining overall high routing capability.
Solution Approach 2:
The patent adds a vertical dimension to routing by incorporating through-holes in the glass routing structure that extend through the thickness of the package. This three-dimensional routing approach increases routing capacity without increasing substrate plane density, thereby reducing manufacturing complexity.
2Adaptability or versatility
If high density trace routing is implemented on the substrate, then routing capability is improved, but substrate thickness must be increased
Solution Approach 1:
The patent utilizes the thickness dimension of the glass routing structure to provide routing pathways through vertical through-holes. This allows routing capacity to be increased by exploiting the third dimension rather than increasing substrate thickness, enabling thinner substrates to achieve the same routing capability.
Solution Approach 2:
The glass routing structure with its through-holes is integrated with the substrate trace routing system, creating a nested arrangement where the glass structure provides additional routing pathways within the existing package footprint, eliminating the need for thicker substrates.
3Ease of manufacture
If glass routing structure is integrated with trace routing substrate, then routing density requirements are relaxed, but manufacturing process complexity increases
Solution Approach 1:
The glass routing structure is prepared separately with through-holes and routing features formed in advance, before integration with the substrate. This preliminary fabrication allows each component to be optimized independently, simplifying the overall manufacturing process despite the additional integration step.
Data Source
AI summary
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure.