LED Array Module Thermal Pathway via Solder Layer
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Solution Overview
Problem
Existing LED array modules face inefficiencies in heat dissipation due to high thermal resistance between the LED chip and the heat slug, and the use of thermal interface materials with low thermal conductivity, which can lead to overheating and reduced lifespan, especially in high-output power applications.
Innovation Solution
The LED array module incorporates a heat-dissipating plate with a solder layer of superior thermal conductivity, eliminating the need for thermal interface materials and insulation boards, and optionally includes a metal thick film layer and heat pipes, fabricated using screen-printing and thermal treatment methods, to create a direct and efficient thermal pathway for heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thermal interface material (TIM) is used between the heat slug and the heat-dissipating plate, then the LED package can be assembled, but the thermal conductivity is limited to about 2-4 W/m·K causing poor heat dissipation
Solution Approach 1:
The patent removes the thermal interface material (TIM) from the heat dissipation path between the heat slug and the heat-dissipating plate. By eliminating this layer with low thermal conductivity (2-4 W/m·K), the invention creates a direct thermal contact that removes the thermal resistance bottleneck, allowing efficient heat transfer from the LED chip through the heat slug to the heat-dissipating plate.
Solution Approach 2:
The invention uses a solder layer as a composite material solution that provides both mechanical bonding and superior thermal conductivity. The solder layer replaces the TIM while maintaining assembly functionality, achieving both structural integrity and high thermal conductivity for efficient heat dissipation.
2Reliability
If an insulation layer is placed between the heat slug and the heat-dissipating plate for electrical insulation, then electrical safety is improved, but thermal conductivity decreases creating a thermal bottleneck
Solution Approach 1:
The solder layer serves as an intermediary material that simultaneously provides both electrical insulation and high thermal conductivity. Unlike traditional insulation materials that block heat flow, the solder layer acts as a thermal conduit while maintaining electrical isolation between the heat slug and the heat-dissipating plate, resolving the contradiction between electrical safety and thermal efficiency.
Solution Approach 2:
The invention changes the material parameter selection by using solder with high thermal conductivity instead of traditional low-conductivity insulation materials. This parameter change in material selection allows the insulation layer to also function as a thermal pathway, eliminating the thermal bottleneck while maintaining electrical insulation.
3Reliability
If additional via holes are drilled and filled to create thermal passages, then heat dissipation is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention merges the thermal dissipation function with the existing PCB structure by utilizing the solder layer that is already part of the standard assembly process. Instead of adding separate thermal vias and filling operations, the solder layer itself serves as the thermal pathway, combining structural bonding and heat dissipation functions into a single element, thereby simplifying the manufacturing process.
Solution Approach 2:
The solder layer is designed to perform multiple functions simultaneously: electrical connection, mechanical bonding, and thermal conduction. This multi-functionality eliminates the need for additional dedicated thermal management structures like filled via holes, reducing manufacturing complexity while achieving effective heat dissipation.
4Illumination intensity
If high-output power LED chips are used to increase illumination, then light output is improved, but heat generation increases requiring advanced heat-dissipating technologies
Solution Approach 1:
The invention converts the harmful effect of high heat generation from high-output LED chips into a beneficial thermal management system. By creating a direct thermal pathway through the solder layer with high thermal conductivity, the heat that would otherwise damage the LED or surrounding components is efficiently conducted away, allowing the high-power LEDs to operate at their full potential without thermal damage.
Solution Approach 2:
The invention changes the thermal conductivity parameter of the interface between the heat slug and heat-dissipating plate by using solder instead of TIM or insulation materials. This parameter change enables the system to handle the high heat flux generated by high-output power LED chips, allowing increased illumination without proportional increase in temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly enhances thermal dissipation efficiency, reduces manufacturing costs, and improves productivity by eliminating thermal bottlenecks and using cost-effective ceramic materials, while maintaining environmental resistance.
Implementation Method 1
a first solder layer bonded between a top surface of the heat-dissipating plate and a bottom surface of the heat slug
Implementation Method 2
the heat-dissipating plate may include a heat pipe therein
Implementation Method 3
a metal thick film layer inserted between the top surface of the heat-dissipating plate and a bottom surface of the first solder layer, the metal thick film layer having thermal conductivity greater than that of the first solder layer
Data Source
AI summary
The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.