Phenoxy Resin Cyclohexane Fluorene Rings Heat Resistance

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Solution Overview

Problem

Conventional bisphenol A type high-molecular-weight epoxy resins and brominated phenoxy resins fail to meet the requirements for high heat resistance, adhesiveness, and low hygroscopicity, while existing alternatives either lack sufficient heat resistance or environmental sustainability.

Innovation Solution

A phenoxy resin with a weight average molecular weight of 10,000 to 200,000, comprising a divalent group with a cyclohexane or fluorene ring structure, offering excellent heat resistance, solvent solubility, and adhesiveness, and a resin composition that includes a crosslinking agent and inorganic filler for enhanced properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If conventional bisphenol A type high-molecular-weight epoxy resins are used, then film-forming properties and adhesiveness are improved, but heat resistance and water resistance are insufficient

Engineering Contradiction:

ImproveadhesivenessVSAvoidheat resistance

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent employs a composite molecular structure combining cycloaliphatic rings (for adhesiveness and flexibility) and aromatic rings (for heat resistance and water resistance). This structural composite at the molecular level allows the resin to simultaneously achieve good film-forming properties, strong adhesiveness, and high heat resistance without compromising any single property

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent systematically adjusts the ratio of cycloaliphatic to aromatic rings in the molecular structure, along with controlling molecular weight and functional group content, to optimize the balance between adhesiveness and heat resistance. By varying these structural parameters, the resin can be tuned for specific application requirements

Inventive Principle:

Principle #35Parameter changes

2Object-affected harmful factors

If brominated phenoxy resins are used to impart flame retardance, then flame resistance is improved, but environmental sustainability deteriorates

Engineering Contradiction:

Improveflame resistanceVSAvoidenvironmental sustainability

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The patent removes harmful bromine atoms from the molecular structure while retaining the essential flame-resistant and adhesive properties through alternative hydrocarbon structures. This extraction of the harmful component (bromine) eliminates environmental concerns while maintaining functional performance

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent uses conventional, environmentally benign hydrocarbon structures (cycloaliphatic and aromatic rings) that are readily available and easily processed, replacing complex brominated structures. These standard hydrocarbon building blocks provide sufficient performance without the environmental burden of halogenated compounds

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Strength

If high-molecular weight is increased to improve film-forming properties, then film-forming properties are improved, but solvent solubility deteriorates

Engineering Contradiction:

Improvefilm-forming propertiesVSAvoidsolvent solubility

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The patent introduces specific local structural features (cycloaliphatic rings with particular substitution patterns and aromatic ring configurations) that enhance film-forming capabilities at the molecular level without proportionally increasing overall molecular weight. These localized structural optimizations provide good film formation while maintaining reasonable solubility

Inventive Principle:

Principle #3Local quality

4Temperature

If glass transition temperature is increased to improve heat resistance, then heat resistance is improved, but water resistance deteriorates

Engineering Contradiction:

Improveheat resistanceVSAvoidwater resistance

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent uses a composite molecular architecture where cycloaliphatic rings contribute to high glass transition temperature and heat resistance, while aromatic rings provide water resistance and dimensional stability. This dual-structure composite ensures that increasing Tg for heat resistance does not compromise water resistance, as both properties are supported by different structural components working synergistically

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS11807711B2Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor

Publication Date: 2023.11.07 NIPPON STEEL CHEM & MATERIAL CO LTD

AI summary

Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000:where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.