Multi-layer Insulation Film with Conductive Additives
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Solution Overview
Problem
Conventional insulation films lack cost-effectiveness and fail to meet multiple requirements for insulation, thermal conductivity, and electromagnetic shielding, often requiring thicker metal sheets that increase production costs and complexity.
Innovation Solution
A multi-layer insulation film comprising a heat-conduction plastic upper and lower layer with a conductive additive intermediate layer, made from materials like PC, PET, PI, PP, PA, carborundum, boron nitride, carbon black, and metal powders, which provides insulation, thermal conductivity, and mechanical toughness, allowing for reduced thickness while meeting regulatory standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional insulation films use thicker metal sheets to meet insulation and shielding requirements, then insulation performance and electromagnetic shielding are improved, but production cost and device complexity increase
Solution Approach 1:
The patent uses composite plastic materials containing heat conduction additives (such as aluminum oxide, boron nitride, or carborundum) to create a multi-functional insulation film that combines insulation, heat dissipation, and EMI shielding properties in a single layer, eliminating the need for multiple metal sheets and reducing structural complexity
Solution Approach 2:
The insulation film is designed to perform multiple functions simultaneously: electrical insulation, thermal conduction, and electromagnetic interference shielding, allowing a single material to replace what would traditionally require multiple separate components
2Reliability
If conventional insulation films use thicker metal sheets to meet regulatory standards, then voltage resistance and shielding effectiveness are improved, but manufacturing cost increases
Solution Approach 1:
The patent modifies the physical and chemical parameters of plastic materials by incorporating specific concentrations of heat conduction additives and conductive additives, changing the material properties to achieve required voltage resistance and shielding effectiveness without increasing thickness or cost
3Temperature
If conventional insulation films increase thickness to meet thermal conductivity requirements, then heat dissipation performance is improved, but device compactness and processing ease deteriorate
Solution Approach 1:
The patent changes the thermal conductivity parameter of the plastic material by incorporating heat conduction additives, enabling thin films to achieve high heat dissipation performance without increasing thickness, thus maintaining ease of processing and device compactness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The film achieves effective insulation, thermal conductivity, and electromagnetic shielding with reduced thickness, lowering production costs and simplifying processing, while maintaining mechanical strength and passing stricter voltage and Mandrel tests.
Implementation Method 1
the heat conduction plastics contain plastics (such as PC, PET, PI, PP, PA, and so forth) and heat conduction additives (such as carborundum, boron nitride, metal oxide, and so forth) to meet the insulativity and thermal conductivity
Implementation Method 2
the film intermediate layer is made of plastics (such as PC, PET, PI, PP, PA, and so forth) and conductive additives (such as carbon black, carbon fiber, metal powder, conducting polymer, and so forth) to meet the electrical conductivity, thermal conductivity and mechanical toughness
Data Source
AI summary
The present invention provides an insulation film and a method for making the insulation film, comprising a film upper layer and a film lower layer, wherein both of the film upper layer and film lower layer are made of a heat conduction plastics material, the heat conduction plastics material contains a heat conduction additive; and a film intermediate layer located between the film upper layer and the film lower layer. The film intermediate layer is made of a heat conduction plastics material, and the heat conduction plastics material contains a conductive additive An upper surface of the film intermediate layer is bound together with a lower surface of the film upper layer, and a lower surface of the film intermediate layer is bound together with an upper surface of the film lower layer.