Interlayer Composition for Electronic Printing Adhesion
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Solution Overview
Problem
Metal nanoparticle inks on substrates like glass and polyimide often lack adequate adhesion and mechanical robustness, which can compromise the performance of electronic devices, and previous solutions that improve adhesion, such as adding polyvinyl butyral, may reduce electrical conductivity.
Innovation Solution
A composition comprising polyvinyl butyral, a poly(melamine-co-formaldehyde) based polymer, and an anhydride is used to form an interlayer that enhances adhesion and conductivity of conductive features without sacrificing mechanical properties, including the optional use of epoxy resin, surfactants, and catalysts to control wetting and curing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If polyvinyl butyral is added to silver conducting inks as an adhesion promoter, then adhesion of metal nanoparticle inks on substrates is improved, but electrical conductivity of printed conductive features is significantly decreased
Solution Approach 1:
The patent introduces an interlayer composition comprising polyvinyl butyral resin, poly(melamine-co-formaldehyde) based polymer, and anhydride as a mediator between the substrate and conductive features. This interlayer acts as an intermediary that promotes adhesion while maintaining electrical conductivity, resolving the contradiction by separating the adhesion function from the conductive function.
Solution Approach 2:
The patent uses a composite interlayer material combining polyvinyl butyral resin, poly(melamine-co-formaldehyde) based polymer, and anhydride. This composite material provides both adhesion promotion and electrical conductivity maintenance, resolving the contradiction by integrating multiple functions into a single composite system.
2Strength
If polyvinyl butyral is added to improve adhesion, then mechanical robustness is enhanced, but device fabrication reliability is compromised due to reduced conductivity
Solution Approach 1:
The interlayer composition serves as a mediator that provides mechanical robustness through polyvinyl butyral resin while maintaining device fabrication reliability by incorporating poly(melamine-co-formaldehyde) based polymer and anhydride that preserve electrical conductivity.
Solution Approach 2:
The composite interlayer material combines polyvinyl butyral resin for mechanical robustness with poly(melamine-co-formaldehyde) based polymer and anhydride for maintaining electrical conductivity, thus achieving both mechanical strength and device fabrication reliability simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The interlayer composition significantly improves adhesion and maintains high electrical conductivity, providing excellent insulative properties without requiring costly materials like polyvinyl phenol, and allows for robust mechanical properties in electronic devices.
Implementation Method 1
adhesion of metal nanoparticle inks on certain substrates, such as glasses and polyimide
Implementation Method 2
a polyvinyl butyral represented by the following formula... a poly(melamine-co-formaldehyde) based polymer and an anhydride
Implementation Method 3
electrical conductivity of printed conductive features from such inks
Implementation Method 4
a cured film formed from a composition including a polyvinyl butyral resin... a poly(melamine-co-formaldehyde) based polymer and an anhydride
Implementation Method 5
poly(melamine-co-formaldehyde) based polymer
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
The present disclosure is directed to a composition including a polyvinyl butyral represented by the following formula: wherein A, B and C represent a proportion of corresponding repeat units expressed as a weight percent, wherein each repeat unit is randomly distributed along a polymer chain and wherein the sum of A, B and C is about 100 weight percent; a poly(melamine-co-formaldehyde) based polymer and an anhydride. Devices coated with the composition and cured films formed from the composition comprising conductive features are also provided.