Multilayer Substrate Asymmetric Electrode Design for High-Frequency Signal Integrity
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Solution Overview
Problem
Multilayer substrates used in high frequency bands suffer from unwanted electrostatic capacitance due to the close proximity of front and internal electrodes, which deteriorates high frequency characteristics.
Innovation Solution
A multilayer substrate design where the front electrode is smaller than the internal electrode and positioned within its outer edge, with a tapered interlayer connection conductor that reduces the electrostatic capacitance by minimizing the overlap area between the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the multilayer substrate is reduced in size and thickness, then the substrate becomes more compact, but the interval between front electrode and internal electrode becomes shorter, generating larger electrostatic capacitance
Solution Approach 1:
The patent applies asymmetry by making the front electrode smaller than the internal electrode and positioning it within the outer edge of the internal electrode. This asymmetric configuration reduces the overlapping area between the two electrodes, thereby reducing electrostatic capacitance. The interlayer connection conductor also has an asymmetric tapered shape with a larger cross-sectional area at the internal electrode end than at the front electrode end, further optimizing the electric field distribution to minimize capacitance.
Solution Approach 2:
The patent applies local quality by varying the cross-sectional area of the interlayer connection conductor along its length. The conductor has a larger cross-sectional area at the internal electrode end and a smaller cross-sectional area at the front electrode end. This localized variation in conductor geometry optimizes the electric field distribution in different regions, reducing electrostatic capacitance between the front electrode and internal electrode while maintaining effective electrical connection.
2Object-generated harmful factors
If the front electrode is made larger to reduce electrostatic capacitance, then capacitance decreases, but the substrate area increases
Solution Approach 1:
The patent applies asymmetry by making the front electrode smaller than the internal electrode and positioning it within the outer edge of the internal electrode. This asymmetric configuration reduces the overlapping area between the two electrodes, thereby reducing electrostatic capacitance without requiring an increase in substrate area. The interlayer connection conductor also has an asymmetric tapered shape that optimizes the electric field distribution.
3Ease of manufacture
If conventional interlayer connection conductors with uniform or increasing diameter are used, then manufacturing is simpler, but electrostatic capacitance between front and internal electrodes increases
Solution Approach 1:
The patent applies local quality by varying the cross-sectional area of the interlayer connection conductor along its length. The conductor has a larger cross-sectional area at the internal electrode end and a smaller cross-sectional area at the front electrode end. This localized variation in conductor geometry optimizes the electric field distribution in different regions, reducing electrostatic capacitance between the front electrode and internal electrode while maintaining effective electrical connection.
Solution Approach 2:
The patent applies parameter changes by modifying the geometric parameters of the interlayer connection conductor, specifically its cross-sectional area along the length. The conductor transitions from a smaller cross-section at the front electrode end to a larger cross-section at the internal electrode end. This parameter variation optimizes the electric field distribution and reduces electrostatic capacitance.
Data Source
AI summary
A multilayer substrate includes a multilayer body in which insulating layers are laminated in a laminating direction, a front electrode that is provided on a front surface side of a first insulating layer which is positioned on a front surface side of the multilayer body among the insulating layers, a first internal electrode that is provided on an opposite side to the front electrode with the first insulating layer interposed therebetween, and a first interlayer connection conductor that electrically connects the front electrode and the first internal electrode with each other. The first interlayer connection conductor includes a front side connection surface that is electrically connected with the front electrode and a back side connection surface that is electrically connected with the first internal electrode.