Hard Gold Edge Connector PCB Manufacturing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The production of printed circuit boards with hard gold-plated edge connectors and ENEPIG-treated connector pads is costly and environmentally challenging due to the dissolution of organic protective layers into ENEPIG chemical baths, leading to contamination and increased disposal costs.
Innovation Solution
Embedding hard gold-plated edge connectors within insulating and conductive layers, using a release layer to prevent adhesion and facilitate easy removal, thereby isolating them from ENEPIG chemicals and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If hard gold-plated edge connectors are produced with organic protective layers to prevent adhesion, then ease of manufacture is improved, but the protective layers dissolve into ENEPIG chemical baths causing contamination and increasing disposal costs
Solution Approach 1:
The patent extracts and removes the problematic organic protective layer from the manufacturing process. Instead of using organic protective layers that dissolve into chemical baths, the invention uses a water-soluble protective layer that can be easily removed without contaminating the ENEPIG chemical baths, thereby eliminating the harmful contamination effect while maintaining ease of manufacture
Solution Approach 2:
The patent changes the chemical parameter of the protective layer from organic (insoluble in water, dissolves in chemicals) to water-soluble. This parameter change allows the protective layer to be easily removed by water rinsing without dissolving into the ENEPIG chemical baths, thus preventing contamination while maintaining manufacturing simplicity
2Reliability
If dry film or photoresist lacquer is used to cover hard gold-plated edge connectors during ENEPIG treatment, then the connectors are protected from chemical dissolution, but the organic material dissolves into the baths causing contamination and increased disposal costs
Solution Approach 1:
The patent employs a disposable water-soluble protective layer that serves its protection function during ENEPIG treatment and then is easily discarded through water rinsing. This disposable layer protects the hard gold-plated edge connectors from chemical dissolution while avoiding the contamination problem of organic materials, as it can be removed without dissolving into the chemical baths
Solution Approach 2:
The water-soluble protective layer acts as an intermediary between the hard gold-plated edge connector and the ENEPIG chemical bath. It provides the necessary protection during treatment while being compatible with the water-based removal process, thus preventing contamination of the chemical bath and eliminating disposal issues associated with organic protective layers
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for cost-effective and environmentally safe production of printed circuit boards with different surface finishes, as the insulating and conductive layers protect the hard gold connectors from ENEPIG chemicals, maintaining bath quality and reducing waste disposal issues.
Implementation Method 1
the hard gold-plated edge connector is arranged on an inner conductive layer of the semi-finished product and is fully covered by at least one group of an insulating layer and a conductive layer
Implementation Method 2
a release layer is provided on the hard gold-plated edge connector
Data Source
Figure 1~2
Figure 3a~3
AI summary
A semi-finished product for the production of a printed circuit board having a plurality of alternately arranged insulating layers (11) and conductive layers (12) and at least one hard gold-plated edge connector (5) is characterised by the hard gold-plated edge connector (5) being arranged on an inner conductive layer (1) of the semi-finished product and being fully covered by at least one group of an insulating layer (11) and a conductive layer (12). The inventive Method for producing a printed circuit board having a plurality of alternately arranged insulating layers (11) and conductive layers (12) and at least one hard gold-plated edge connector (5), where an outer conductive layer is surface treated, is characterised by the steps of providing a hard gold-plated edge connector (5) on a group of an insulating layer (1) and a conductive layer (2), covering the conductive layer (2) and the hard gold-plated edge connector (5) with at least one group of an insulating layer (11) and a conductive layer (12), surface-treating an outer conductive layer (12) to form connector pads (13) for wire bonding of electronic components, cutting the insulating layers (11) and the conductive layers (12) down to the conductive layer (2) forming the hard gold-plated edge connector, removing the insulating layers (11) and conductive layers (12) from the hard gold-plated edge connector (5). The inventive printed circuit board comprised of a plurality of alternately arranged insulating layers and conductive layers and at least one hard gold-plated edge connector is characterised by the hard gold-plated edge connector (5) being arranged on an inner conductive layer (2) of the printed circuit board, and the inner conductive layer (2) forming the hard gold-plated edge connector (5) protruding from the plurality of insulating layers (11) and conductive layers (2).