High-Capacity PCB Copper Trace Stacking
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Solution Overview
Problem
The existing printed circuit board (PCB) production processes are limited by the thickness of copper traces, which restricts the formation of fine conductive traces, leading to insufficient capacity for high-density circuitry.
Innovation Solution
A method involving copper plating and electroplating techniques to form conductive trace patterns on both sides of a base copper foil, with protecting layers to enhance trace durability and capacity, resulting in a printed circuit board with high-capacity copper circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thin copper is used to form fine conductive traces, then the PCB can achieve finer trace dimensions, but the copper circuit capacity is limited
Solution Approach 1:
The patent transitions from two-dimensional thin copper traces to three-dimensional thick copper structures by stacking multiple copper layers (base copper foil, first copper plating layer, second copper plating layer) vertically. This dimensional change enables significantly increased copper capacity while maintaining fine trace dimensions through precise lateral patterning.
Solution Approach 2:
The patent creates a composite copper circuit structure combining different copper layers (base copper foil with specific grain structure, electroplated copper layers) with protective layers (resin layers, solder resist layers). This composite approach enhances both the mechanical strength and electrical capacity of the traces.
2Quantity of substance
If thicker copper is used to increase circuit capacity, then the copper capacity improves, but the trace width increases and fine circuitry is lost
Solution Approach 1:
The patent resolves this contradiction by moving the thickness increase to the vertical dimension through multi-layer stacking, while maintaining precise lateral dimensions through photolithographic patterning. The thick copper structure achieves high capacity without compromising trace width precision.
Solution Approach 2:
The patent divides the thick copper circuit into multiple segmented layers (base copper foil, first copper plating layer, second copper plating layer) that are stacked and patterned separately. This segmentation allows independent optimization of each layer's thickness and pattern, achieving both high capacity and fine precision.
3Quantity of substance
If copper plating and electroplating processes are used to form thick copper traces, then the manufacturing complexity increases, but the copper circuit capacity is enhanced
Solution Approach 1:
The patent applies preliminary action by first forming the base copper foil with controlled grain structure and thickness before applying subsequent plating layers. The base layer serves as a pre-prepared substrate that simplifies subsequent patterning and plating operations, reducing overall process complexity.
Solution Approach 2:
The patent implements a nested structure where the first copper plating layer is formed on the base copper foil, and the second copper plating layer is formed on the first plating layer. Each layer is nested within the previous one, creating a compact vertical stack that maximizes copper capacity within limited space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the creation of printed circuit boards with increased copper circuit capacity, allowing for thicker conductive traces and improved electrical performance by maintaining consistent trace widths and thicknesses, thereby enhancing the PCB's ability to support high-density electronic components.
Implementation Method 1
A method involving copper plating and electroplating techniques to form conductive trace patterns
Data Source
AI summary
A printed circuit board with high-capacity and high-current copper circuit includes a conductive trace, a first protecting layer, and a second protecting layer on opposite sides of the conductive trace. The conductive trace includes a basic conductive trace pattern, a first conductive trace pattern, and a second conductive trace pattern. The first and second conductive trace patterns are directly formed on opposite surfaces of the basic copper conductive trace pattern. A width of trace of the first conductive trace pattern is the same as a line width of the second conductive trace pattern.