Multilayer Board Interlayer Conductor Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing multilayer boards face disconnection issues due to the difference in thickness and bonding strength between insulator layers and conductor layers, particularly in regions with varying insulator layer configurations, which can lead to gaps and poor contact during thermal pressure bonding.
Innovation Solution
A multilayer board design featuring interlayer connection conductors with varying cross-sectional areas and shapes, where the second interlayer connection conductor has a larger area than the first interlayer connection conductors, ensuring a larger contact area and reducing the likelihood of disconnection by providing a space for fusion-bonding of insulator layers and joining with conductor layers during thermal pressure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the second insulator layer is omitted in the second region, then the multilayer board becomes thinner and more flexible, but the bonding strength decreases and disconnection occurs
Solution Approach 1:
The patent applies local quality by having different insulator layer configurations in different regions: the first region has all three insulator layers for high bonding strength, while the second region has only the first and third insulator layers for flexibility. This regional differentiation resolves the contradiction by optimizing each region for its specific function.
Solution Approach 2:
The patent changes the parameter of insulator layer thickness and configuration in different regions. By reducing the number of insulator layers in the second region, the overall thickness is reduced and flexibility is improved, while the bonding strength is compensated through other means (larger conductor area, optimized bonding process).
2Strength
If the contact area between interlayer connection conductor and conductor layer is increased, then bonding strength is enhanced, but the device complexity increases
Solution Approach 1:
The patent resolves the contradiction by changing the dimensional approach: instead of increasing the contact area in the planar dimension (which would increase complexity), it increases the contact area in the vertical dimension by having the second interlayer connection conductor pass through the entire thickness of the first insulator layer and contact the conductor layer on its lower surface. This vertical extension provides larger bonding area without complicating the planar conductor routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents disconnection by increasing the contact area between interlayer connection conductors and conductor layers, enhancing the bonding strength and allowing for closer pitch arrangements of interlayer connection conductors, thus improving the reliability and flexibility of the multilayer board.
Implementation Method 1
The second interlayer connection conductor is joined to the conductor and the first conductor layer
Data Source
AI summary
A multilayer board in which interlayer connection conductors include one or more first interlayer connection conductors in a first region and passing through any of a first insulator layer, a second insulator layer, and a third insulator layer in an up-down direction and a second interlayer connection conductor located in a second region and passing through the third insulator layer in the up-down direction. The second interlayer connection conductor is joined to a conductor and a second conductor layer. An area of the second interlayer connection conductor viewed in the up-down direction is larger than a minimum value of areas of the one or more first interlayer connection conductors viewed in the up-down direction.