Flexible Printed Circuit Board Antenna Module for mmWave Signal Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency RF signals in mmWave communication are easily absorbed, leading to significant signal loss and communication quality issues, requiring specialized antenna technologies to secure gain and effective isotropic radiated power.
Innovation Solution
A modular printed circuit board with a core layer and alternating build-up structures, incorporating a flexible region with a through-portion, is designed to support chip antennas and wireless communication chips, utilizing materials with low dielectric loss factors to enhance signal transmission and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a rigid printed circuit board structure is used to support chip antennas and wireless chips, then structural stability is improved, but flexibility and adaptability are worsened
Solution Approach 1:
The printed circuit board is divided into a rigid base region (core layer with build-up structures) and a flexible region (without core layer), allowing different parts to serve different functions - the rigid part provides structural stability while the flexible part provides adaptability for bending and conformal mounting
Solution Approach 2:
Different regions of the printed circuit board have different structural properties - the base region has a core layer for rigidity and stability, while the flexible region lacks a core layer to enable bending and flexibility, allowing each region to be optimized for its specific function
2Adaptability or versatility
If through-portions are created in the core layer for flexibility, then flexibility is improved, but structural strength is worsened
Solution Approach 1:
The core layer is completely removed in the flexible region to create through-portions, extracting the rigid structural element from that specific area to enable flexibility while maintaining the core layer in the base region to preserve overall structural strength
Solution Approach 2:
The printed circuit board transitions from a fully planar rigid structure to a three-dimensional form with bent portions, allowing the flexible region to bend along bending lines while the rigid base region maintains its planar integrity, achieving flexibility without compromising overall structural strength
3Reliability
If complex multi-layer build-up structures are used for high-frequency signal transmission, then signal transmission quality is improved, but manufacturing complexity is worsened
Solution Approach 1:
The build-up structures are segmented into discrete alternating layers of insulating layers and bonding layers with wiring layers, allowing each layer to be optimized for specific functions (signal transmission, grounding, insulation) while maintaining a manageable manufacturing process through systematic layer-by-layer construction
Data Source
AI summary
A printed circuit board and an antenna module including the same are provided. The printed circuit board includes a core layer; a first build-up structure disposed on an upper side of the core layer, including first insulating layers and first bonding layers, alternately stacked, and further including first wiring layers disposed on upper surfaces of the first insulating layers, respectively, and embedded in the first bonding layers, respectively; and a second build-up structure disposed on a lower side of the core layer, including second insulating layers and second bonding layers, alternately stacked, and further including second wiring layers disposed on lower surfaces of the second insulating layers, respectively, and embedded in the second bonding layers, respectively. The printed circuit board has a through-portion penetrating through the core layer and the second build-up structure, and has a region in which the through-portion is disposed as a flexible region.