Electronic Component Assembly Using an Alumina Interposer Board
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Solution Overview
Problem
Existing electronic components with interposer boards made of glass epoxy resin lack resistance to deflection, leading to inadequate noise reduction and vibration propagation.
Innovation Solution
An electronic component design featuring an alumina interposer board with specific structural and material enhancements, including a Cu fired layer, Zn-containing layer, and a mark portion, which provides increased stiffness and noise reduction capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If an interposer board made of glass epoxy resin is used, then the electronic component can be manufactured with conventional materials and processes, but the interposer board lacks resistance to deflection and allows vibration propagation
Solution Approach 1:
The patent changes the material parameter of the interposer board from glass epoxy resin to alumina ceramic. This material substitution fundamentally improves the resistance to deflection and vibration attenuation properties while maintaining compatibility with conventional electronic component manufacturing processes through ceramic bonding techniques.
Solution Approach 2:
The patent employs alumina ceramic as a composite material for the interposer board, which combines high stiffness, low vibration propagation, and good electrical insulation properties. The ceramic material inherently provides superior mechanical strength and resistance to deflection compared to organic resin-based materials.
2Reliability
If an alumina interposer board is used, then resistance to deflection and vibration attenuation are improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent changes the material parameter from glass epoxy resin to alumina ceramic, which fundamentally improves noise reduction capability and vibration attenuation. The ceramic material's inherent physical properties provide superior performance without requiring additional structural complexity or multiple components.
Data Source
AI summary
An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.