Ceramic Microelectronics With Continuous Electrodes Instead of Vias
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Solution Overview
Problem
Existing ceramic microelectronic devices require complex manufacturing processes involving vias, which can lead to poor connections, device failures, and increased manufacturing costs due to the need for multiple steps and potential issues with via filling and shrinkage.
Innovation Solution
The use of continuous electrodes between ceramic dielectric layers, eliminating the need for vias by forming bent structures that connect external and internal layers, simplifying the manufacturing process and reducing the risk of connection failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are used to connect ceramic dielectric layers, then electrical connections between layers can be established, but manufacturing complexity increases and connection reliability decreases due to multiple steps and potential filling/shrinkage issues
Solution Approach 1:
The patent removes the via structure entirely from the ceramic microelectronic device. Instead of creating holes and filling them with conductive material, the invention uses continuous conductive layers that extend across the ceramic dielectric layers and are connected through metallization on the ceramic surfaces, completely eliminating the via filling and shrinkage problems associated with traditional via structures.
Solution Approach 2:
The patent combines the functions of separate via structures and surface conductors into a unified continuous conductive path. The conductive layers are extended onto the ceramic dielectric layer surfaces and interconnected through metallization, merging what would traditionally be separate via connections and surface traces into a single integrated conductive system.
2Reliability
If vias are used to form circuits in ceramic microelectronic devices, then electrical connections are achieved, but manufacturing cost increases due to multiple process steps
Solution Approach 1:
The patent eliminates the via formation process entirely from the manufacturing sequence. By using continuous conductive layers that connect across ceramic dielectric layers through surface metallization rather than through-hole filling, the invention removes multiple costly process steps including via drilling, via filling, and via shrinkage compensation.
Solution Approach 2:
The patent merges the conductor formation process with the ceramic layer stacking process. Conductive layers are applied to ceramic dielectric layers and connected through metallization in an integrated manner, combining what would traditionally be separate via formation and conductor tracing operations into a unified manufacturing process.
3Device complexity
If continuous electrodes are used to connect ceramic layers without vias, then manufacturing complexity is reduced and reliability is improved, but device size may increase due to electrode routing requirements
Solution Approach 1:
The patent utilizes the surface dimension of ceramic dielectric layers to route continuous conductive electrodes. Instead of forcing conductors through the thickness dimension via vias, the invention allows conductors to travel across the surface planes of ceramic layers and connect through metallization, effectively using the available surface area to minimize the need for additional device volume.
Data Source
AI summary
Microelectronics having form factors (e.g., dimensions and functionality) comparable with traditional microelectronics, but with considerably simplified design, and their methods of manufacture are provided. Microelectronics and methods that implement microelectronics are capable of being forming without the need for through-vias. Exemplary dielectrics in these embodiments include, but are not limited to, high Q, temperature stable and high k dielectrics. Microelectronics and methods are capable of combination with any other passive electronic component such as a resistor or inductor further improving functionality and reducing space requirements on the circuit. Microelectronics and methods are configured to be mounted to a short block or other device without the use of a through-via, simplifying connection to a circuit.