Ceramic Package Lid Attachment Surface for Stronger Adhesion

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Solution Overview

Problem

Existing packaging technologies for solid state image sensors face challenges in maintaining high adhesion strength between the lid and the frame while reducing the size of the attachment surface, often requiring additional metal components that increase manufacturing costs.

Innovation Solution

A ceramic-based package design with a frame having a protruding attachment surface where at least one end is lower than the most protruding portion by 10 μm or more, allowing for a sufficient adhesive layer thickness without additional components, thereby enhancing adhesion strength and preventing delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the width of the attachment surface is reduced to decrease the size of imaging units, then the size is reduced, but the adhesion strength of the lid decreases

Engineering Contradiction:

Improvesize of imaging unitVSAvoidadhesion strength of lid

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The attachment surface of the frame is designed with a protruding shape that creates local variations in thickness, with the central portion being thicker than the peripheral portions. This local quality differentiation ensures that the adhesive layer maintains sufficient thickness and adhesion strength even when the overall attachment surface width is reduced, thereby resolving the contradiction between miniaturization and adhesion strength.

Inventive Principle:

Principle #3Local quality

2Strength

If a metal frame component with additional structure is added to increase adhesion strength in corners, then adhesion strength is improved, but manufacturing cost significantly increases

Engineering Contradiction:

Improveadhesion strength near cornersVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The invention merges the frame structure with the ceramic substrate by forming the attachment surface protrusions directly on the ceramic frame body. This integration eliminates the need for separate metal reinforcement components while still achieving enhanced adhesion strength at critical areas such as corners, thereby resolving the contradiction between improved adhesion and manufacturing cost.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention changes the geometric parameters of the attachment surface by creating protrusions with specific height variations (central portion thicker than peripheral portions). This parameter modification allows the adhesive layer to maintain optimal thickness distribution across the attachment surface, providing enhanced adhesion strength without requiring additional components or increasing manufacturing complexity.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20230335568A1package

Publication Date: 2023.10.19 NGK ELECTRONICS DEVICES INC

AI summary

A package includes a mounting surface on which an electronic component is to be mounted, a cavity, and an attachment surface to which a lid is to be attached through an adhesive layer. The package includes: a bottom containing ceramics and having the mounting surface; and a frame containing ceramics and having the attachment surface. The attachment surface of the frame includes an inner end adjacent to the cavity and an outer end opposite to the inner end in at least one cross-sectional view spanning an inside and an outside of the cavity, the attachment surface having a protruding shape protruding in a thickness direction. At least one of the inner end or the outer end is made lower than a most protruding portion of the protruding shape by 10 μm or more.