Ceramic Panel Scribe Wells for Clean Substrate Singulation
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Solution Overview
Problem
Substrate scribing during singulation can cause premature breakage or damage due to long or deep scribe lines, or difficulty in singulation due to short or shallow scribe lines, leading to device failures and yield loss.
Innovation Solution
Forming scribe line wells in ceramic panels and creating scribe lines along these wells, which reduces the depth of the scribe lines into the ceramic material while maintaining or increasing their total depth beneath the surface, making singulation easier and reducing the risk of healing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If long or deep scribe lines are used, then substrate singulation is achieved, but premature breakage or damage occurs during substrate handling
Solution Approach 1:
The scribe line is segmented into multiple shallow sections by forming grooves at intervals along the scribe line path. These grooves divide the continuous deep scribe line into discrete segments, preventing stress propagation that would cause premature breakage while maintaining effective singulation at each groove location.
Solution Approach 2:
The solution transitions from modifying scribe line depth (vertical dimension) to modifying scribe line continuity (horizontal dimension) by introducing periodic grooves. This dimensional shift allows the scribe line to remain shallow overall while still achieving complete substrate separation through cumulative effect of multiple segmented cuts.
2Reliability
If short or shallow scribe lines are used, then substrate breakage is reduced, but device failures, burrs, or cracks occur during singulation
Solution Approach 1:
The periodic grooves create a continuous series of shallow cuts along the scribe line path. While each individual groove is shallow, the cumulative effect of multiple continuous grooves achieves complete substrate separation without the need for any single deep cut, maintaining both substrate integrity and singulation quality.
Solution Approach 2:
Instead of applying one excessive deep cut, the solution uses multiple partial shallow cuts (grooves) distributed along the scribe line. Each groove performs a partial singulation function, and the combination of these partial actions achieves complete substrate separation without exceeding the safe depth threshold that causes breakage.
3Manufacturing precision
If deep scribe lines are used, then singulation is achieved, but scribe lines partially heal themselves becoming shallower
Solution Approach 1:
The grooves are formed preliminarily at specified intervals along the intended scribe line path before final singulation. This preliminary structuring of the ceramic substrate creates predetermined weak points that guide the singulation process and prevent the ceramic from naturally healing over deep continuous cuts.
Solution Approach 2:
The groove depth and spacing are locally optimized along the scribe line path. Each groove is positioned and sized to create sufficient stress concentration for effective singulation while maintaining overall shallow profile that prevents ceramic material from bridging and healing the scribe line.
Data Source
AI summary
An example ceramic panel has a first surface and a second surface. The ceramic panel has a bond finger well on the first surface of the ceramic panel a scribe line well on the second surface of the ceramic panel. The ceramic panel also has a scribe line along the scribe line well.