Multilayer Ceramic Electrode Plating With Stress-Relief Crack Portions

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Solution Overview

Problem

Multilayer ceramic capacitors are prone to cracking due to external forces applied to their external electrodes.

Innovation Solution

The multilayer ceramic components incorporate a base electrode layer and a plated layer with an electrically conductive resin layer that acts as a buffer, reducing the occurrence of cracks by enhancing flexibility and adhesion to the multilayer body.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external electrodes are applied to multilayer ceramic capacitors, then electrical connectivity is achieved, but cracks may occur in the multilayer body when force is applied to the external electrodes

Engineering Contradiction:
Improvecrack resistanceVSAvoidelectrode adhesion strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent changes the physical and chemical parameters of the external electrode by introducing a glass component into the base electrode layer. This glass component modifies the thermal expansion coefficient and mechanical properties of the electrode, enabling it to better match the multilayer body and reduce stress concentration that leads to cracking.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite material structure for the base electrode layer, combining metal particles (such as silver, palladium, or their alloys) with a glass component. This composite structure provides both electrical conductivity and mechanical flexibility, allowing the electrode to absorb stress without transmitting it to the multilayer body, thereby preventing cracks while maintaining adhesion strength.

Inventive Principle:
Principle #40Composite materials

2Reliability

If a rigid electrode structure is used, then electrical connectivity is ensured, but stress concentration occurs leading to multilayer body cracking

Engineering Contradiction:
Improvecrack resistanceVSAvoidelectrode structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent modifies the mechanical parameters of the electrode by incorporating a glass component with appropriate softness and thermal expansion characteristics. This creates an electrode structure that is neither completely rigid nor too complex, but rather has optimized mechanical properties that reduce stress concentration while maintaining structural integrity and electrical functionality.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces or prevents cracks in the multilayer body, enhancing the durability and reliability of the ceramic capacitors under physical stress.

Implementation Method 1

a main surface-side plated layer provided as an upper layer of the main surface-side base electrode layer. In a cross section in a plane parallel or substantially parallel to the length direction and the height direction, the main surface-side plated layer includes at least one crack portion extending in a region between a boundary line between the main surface-side base electrode layer and the main surface-side plated layer, and a profile line of a surface of the main surface-side plated layer

Methodology Applied
Scientific EffectViscoelasticity: Viscoelasticity

Data Source

PatentUS20250322993A1Multilayer ceramic electronic component
Publication Date: 2025.10.16 MURATA MFG CO LTD
  • US20250322993A1 patent drawing
  • US20250322993A1 patent drawing
  • US20250322993A1 patent drawing

AI summary

A multilayer ceramic electronic component includes an external electrode including a main surface-side base electrode layer and a main surface-side plated layer. In a cross section in a plane parallel or substantially parallel to a length direction and a height direction, the main surface-side plated layer includes at least one crack portion extending in a region between a boundary line between the main surface-side base electrode layer and the main surface-side plated layer, and a profile line of a surface of the main surface-side plated layer.