Ceramic Wafer Plate Plug Structure to Prevent Gas Port Blockage
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Solution Overview
Problem
Existing semiconductor manufacturing apparatus designs with closely packed plugs can experience dielectric breakdown due to gaps between the plug and the chamber, and adhesive materials used to prevent gaps can block gas outlet ports when bonding.
Innovation Solution
A ceramic plate with built-in electrodes and a plug receiving hole structure that includes a stepped portion to prevent adhesive flow into the gas outlet port, using a plug support member made of adhesive material in the gap formed between the plug and the plug receiving hole, and a helical gas flow path to prevent plasma discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a closely packed plug is simply disposed in a space, then the structure is simple, but a gap may be left between the plug and the inner surface of the space causing dielectric breakdown
Solution Approach 1:
An adhesive material is introduced as an intermediary substance between the plug and the space to eliminate gaps. The adhesive fills the void space and bonds the plug to the surrounding structure, preventing dielectric breakdown while maintaining structural integrity.
Solution Approach 2:
The physical state of the adhesive material is utilized - applied in a liquid or paste state to fill gaps, then cured to a solid state to provide mechanical support and electrical insulation. This parameter change allows the same material to serve multiple functions: gap filling, bonding, and dielectric protection.
2Reliability
If the closely packed plug is bonded to the space with a resin-made adhesive to prevent gaps, then dielectric breakdown is prevented, but the adhesive may flow into the gas outlet port to block it
Solution Approach 1:
The space surrounding the plug is segmented into two distinct regions by a stepped portion: a first space for adhesive placement and a second space for gas flow. This spatial segmentation prevents adhesive from encroaching into the gas outlet port while still allowing adequate bonding area.
Solution Approach 2:
A stepped portion is introduced to create a vertical dimension difference between the adhesive placement area and the gas outlet area. The step structure establishes a height differential that physically restricts adhesive flow into the gas outlet port while maintaining bonding surface area.
3Stability of the object's composition
If adhesive material is used to support the plug, then plug placement stability is improved, but the gas flow path may be blocked by the adhesive
Solution Approach 1:
The internal structure of the plug is segmented to include a dedicated gas flow path that is spatially separated from the adhesive placement region. The gas flow path is formed as a distinct channel within the plug body, ensuring that adhesive material cannot block gas flow while still providing structural support.
Data Source
AI summary
A member for semiconductor manufacturing apparatus, includes: a ceramic plate having a wafer placement surface; a plug receiving hole formed in a surface of the ceramic plate opposite to the wafer placement surface; a gas outlet port extending through a bottom wall of the plug receiving hole; a plug received in the plug receiving hole; and a gas flow path disposed inside the plug to be continuous with the gas outlet port, wherein a stepped portion is disposed on a side surface of the plug or an inner surface of the plug receiving hole, the plug receiving hole and the plug are in contact with each other in an area deeper than the stepped portion, a gap is formed between the plug receiving hole and the plug in an area shallower than the stepped portion, and a plug support member made of an adhesive material is formed in the gap.