Ceramic Power Window with Internal Channels for Uniform Plasma Cooling

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Solution Overview

Problem

Plasma processing chamber components, such as power windows, face issues with nonuniform heating and degradation due to insufficient cooling and exposure to plasma, leading to contaminants and erosion, which affect semiconductor device performance.

Innovation Solution

A spark plasma sintered ceramic component with a plasma-facing surface and serpentine thermal channels is developed, allowing for efficient thermal control and erosion resistance through the use of a protective layer, eliminating termination points and enhancing mechanical strength and uniformity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If cooling gas is blown on the back side of the power window, then cooling is provided, but the cooling capacity is limited and nonuniform heating occurs

Engineering Contradiction:

Improvethermal uniformityVSAvoidcooling capacity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The power window is segmented to include multiple internal cooling channels (e.g., serpentine, radial, or combination patterns) that divide the cooling flow into multiple pathways. This segmentation allows uniform heat dissipation across the entire power window surface, eliminating hot spots and achieving thermal uniformity while maintaining high cooling capacity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The cooling approach transitions from a single-dimension external gas blow method to a multi-dimensional internal channel network. The cooling fluid flows through channels embedded within the power window thickness, creating a three-dimensional cooling structure that provides both high cooling capacity and uniform temperature distribution across the surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Object-affected harmful factors

If plasma resistant coatings are applied to power windows, then erosion resistance is improved, but termination points create contaminants and when coatings are too thick, cracking occurs

Engineering Contradiction:

Improveerosion resistanceVSAvoidcontaminants from termination points

Core Design Contradiction:

Object-affected harmful factorsVSObject-generated harmful factors

Solution Approach 1:

The harmful termination points and coating interfaces are extracted and eliminated by transitioning to a monolithic ceramic power window structure. The entire power window is formed as a single piece of plasma-resistant ceramic material, removing the need for separate coatings and their associated termination points that generate contaminants.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The power window is constructed from composite or gradient ceramic materials that provide plasma resistance throughout the bulk structure. This eliminates the need for thin coating layers that crack and create termination points, as the plasma-resistant properties are inherent to the bulk ceramic material rather than a surface coating.

Inventive Principle:

Principle #40Composite materials

3Productivity

If conventional power windows are used, then simple structure is maintained, but insufficient cooling causes nonuniform processing across wafers

Engineering Contradiction:

Improveprocessing uniformityVSAvoidcooling channel structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The cooling function is merged directly into the power window structure by embedding cooling channels within the ceramic body. This integration combines the power transmission and cooling functions into a single component, achieving uniform processing across wafers while the internal channel design maintains structural compactness.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The ceramic power window utilizes a controlled porous or channelled internal structure to facilitate coolant flow. The porous or channelled design allows efficient heat removal through the bulk material, achieving uniform temperature distribution and processing uniformity across wafers.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides improved thermal uniformity, increased erosion resistance, and extended component lifespan, reducing contaminants and maintaining process consistency across wafers, thereby enhancing semiconductor processing quality.

Implementation Method 1

The ceramic powder is sintered to form a solid part

Methodology Applied

Scientific EffectSintering: Sintering

Implementation Method 2

at least one serpentine thermal channel extending through the ceramic component body. A thermal control is in fluid connection with the at least one serpentine thermal channel

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the thermal control is adapted to flow fluid through the at least one serpentine thermal channel

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 4

A spark plasma sintered ceramic component body

Methodology Applied

Scientific EffectSpark plasma sintering: Spark Plasma Sintering

Data Source

PatentUS20230411124A1Ceramic component with channels

Publication Date: 2023.12.21 LAM RES CORP

AI summary

A method for forming a component for a plasma processing chamber is provided. An internal mold is provided. An external mold is provided around the internal mold. The external mold is filled with a ceramic powder, wherein the ceramic powder surrounds the internal mold. The ceramic powder is sintered to form a solid part. The solid part is removed from the external mold.