Composite Board with Ceramic Base and Resin Covering for LED Manufacturing
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Solution Overview
Problem
The existing manufacturing methods for light-emitting devices using ceramic boards are time-consuming and costly, and they do not efficiently produce composite boards with strength comparable to ceramic boards.
Innovation Solution
A composite board is created with a ceramic base, exposed first and second wiring, and a covering member made of resin, which is less expensive and easier to cut than ceramic, allowing for faster and cheaper production of light-emitting devices by singulating the board assembly through the covering member rather than the ceramic base.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a ceramic board is used for manufacturing light-emitting devices, then the device strength is high, but the manufacturing time is long and cost is high
Solution Approach 1:
The patent uses a composite board structure combining a ceramic base with a resin covering member. The ceramic base provides the necessary strength and thermal properties, while the resin covering member enables easier and faster singulation. This composite approach maintains device strength while improving manufacturing efficiency.
Solution Approach 2:
The patent divides the board into two functional parts: a ceramic base for structural integrity and a resin covering member for manufacturing ease. This segmentation allows each material to contribute its optimal properties, resolving the contradiction between strength and manufacturability.
2Strength
If a ceramic board is used for manufacturing light-emitting devices, then the device strength is high, but the manufacturing cost is high
Solution Approach 1:
The composite board uses a resin covering member on the ceramic base. The resin material is less expensive and easier to process than full ceramic construction, reducing manufacturing costs while the ceramic base maintains the required device strength.
Solution Approach 2:
The resin covering member serves as a temporary, cost-effective element that facilitates manufacturing processes (especially singulation) but does not need to be as durable as the ceramic base, thereby reducing overall manufacturing cost.
3Productivity
If the board assembly is cut to singulate individual devices, then individual light-emitting devices are obtained, but cutting the ceramic base causes warpage and component damage
Solution Approach 1:
The patent extracts the singulation function from the ceramic base and transfers it to the resin covering member. The resin layer is removed or cut to separate individual devices, while the ceramic base with mounted components remains intact and undamaged.
Solution Approach 2:
The resin covering member acts as an intermediary layer that absorbs the mechanical stress of cutting. It serves as a sacrificial element that protects the ceramic base and mounted components from damage during the singulation process.
Data Source
AI summary
A composite board is provided with a board and a covering member. The board includes a base made of ceramics, first wiring provided on an upper surface of the base, and second wiring provided on a lower surface of the base and electrically connected to the first wiring. The covering member covers the base such that the first wiring and the second wiring are exposed.