Ceramic Multilayer RF Component Shielding for Uniform Film Thickness
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Solution Overview
Problem
High-frequency electronic components with shielding films on ceramic multilayer substrates often suffer from insufficient shielding film thickness due to the micro-loading effect, leading to poor electrical connections and low reliability.
Innovation Solution
The solution involves a ceramic multilayer substrate with ground electrodes at different layers, where the ground electrodes are exposed on the side surfaces and electrically connected to the shielding film, ensuring they do not overlap in the thickness direction, thus preventing the micro-loading effect.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple conductive layers are stacked in the thickness direction to form the shielding film, then the shielding effect is improved, but the film-forming rate changes due to the micro-loading effect causing insufficient thickness and poor electrical connection
Solution Approach 1:
The shielding film is divided into multiple conductive layers stacked in the thickness direction, with each layer having a different pattern density. This segmentation allows the micro-loading effect to be distributed across layers rather than concentrated, improving overall film thickness uniformity and electrical connection reliability.
Solution Approach 2:
Each conductive layer is designed with different pattern densities to compensate for the micro-loading effect at different locations. The first conductive layer has a different pattern density than the second conductive layer, creating local quality variations that balance the overall film formation across the substrate surface.
2Ease of manufacture
If sputtering is performed with the ceramic multilayer substrate placed such that the surface opposite to the mounting surface faces the target, then formation of shielding film on the mounting surface is prevented, but the shielding film thickness becomes insufficient at positions farther from the target
Solution Approach 1:
The shielding film formation process is segmented into multiple sputtering steps, with each step forming a different conductive layer. By controlling the pattern density of each layer differently, the cumulative effect achieves uniform total thickness across the substrate, compensating for the distance-related thickness variation.
Solution Approach 2:
The pattern density parameter is changed between different conductive layers. The first conductive layer has a first pattern density and the second conductive layer has a second pattern density, allowing optimization of film thickness distribution across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a consistent and sufficient shielding film thickness, enhancing electrical connections and reliability of high-frequency electronic components.
Implementation Method 1
Some high-frequency electronic components mounted on mobile devices and others are provided with a shielding film to block magnetic waves.
Implementation Method 2
A shielding film on the side surfaces of a ceramic multilayer substrate may be formed by sputtering, for example.
Data Source
AI summary
A high-frequency electronic component includes a ceramic multilayer substrate, ground electrodes provided at different layers of the ceramic multilayer substrate, and a shielding film covering at least a side surface among surfaces of the ceramic multilayer substrate. Two or more of the ground electrodes are exposed to the side surface of the ceramic multilayer substrate and are electrically connected to the shielding film. On the side surface of the ceramic multilayer substrate, the two or more of the ground electrodes do not overlap each other in a thickness direction of the ceramic multilayer substrate.