Magnetic/Electric Field Screening TRIZ Cases

A layered absorber sheet with Fe-Si and Fe-Si-Al particles cuts eddy currents and inductance drop to improve digital pen position detection.

Controlled ferrite particle density and size enable high filler loading while preserving sheet flexibility, uniformity, and GHz absorption.

Stacked connector layers prevent conductor line overlap while adding spark gaps to ground for multi-column PCB ESD protection.

Rotating cutting and stripping units remove cable foil and outer insulation faster while improving removal uniformity and consistency.

A conductive flexible clip secures a PCB while preserving electrical continuity under vibration and thermal movement, simplifying aircraft bay maintenance.

A two-stage mounting layout increases inductor-to-shield spacing, preserving inductor characteristics in low-height, high-density modules.

A flexible conductive clip secures PCB grounding while allowing thermal and vibration movement, cutting parts count and corrosion protection needs.

Overlapping slit connection portions keep radio-wave transmitting patterns continuous across multi-step laser processing while preserving glass appearance.

Encapsulated gadolinium layers in packages, heat sinks, and circuit boards absorb neutrons to cut SEE upsets without major weight growth.

An axial gasket seal stabilizes busbar protrusion through the control board while maintaining water resistance and improving solderability.

A lattice of high- and low-density scratches helps a metal film absorb 100 MHz to 5 GHz radiation noise without ground connection.

Alternating magnetic and conductive layers improve low- and high-frequency attenuation while keeping the attenuator thin for compact electronics.

Overlapping non-ground and ground wiring layers conduct heat from an insulated heat sink to the housing without sacrificing PCB mounting area.

Separating two vehicle wire harnesses before assembly improves transport efficiency while an integrated shield structure preserves electromagnetic shielding.

Exposed ground electrodes on multilayer ceramic sidewalls stabilize sputtered shielding film thickness and improve electrical connection reliability.

Chalcogenide absorption layers raise high-GHz electromagnetic absorption above 90% to mitigate secondary interference in 5G and 6G use.

A flat wraparound sheath combines conductive and magnetic elements to shield cable fields while fitting tight vehicle spaces.

A convex contact portion with elastic arms enlarges ground contact and shortens return loops to cut insertion loss, crosstalk, and resonance.

A conductive member grounds the component through the resin base to a metal plate, simplifying assembly and protecting EMC performance.

A stacked magnetic shielding film placed between adjacent components cuts magnetic interference while preserving heat dissipation and simpler assembly.

A flexible conductive-ink coating detunes nearby NFC chips to block unauthorized reading while avoiding bulky shielding structures.

A thin magnetic shielding layer with insulation films placed between adjacent components cuts interference, simplifies assembly, and preserves heat dissipation.

A hexagonal double-layer pattern expands absorber bandwidth and preserves periodic tiling on 3D corners and curved surfaces.

A field shaping assembly diversifies orthogonal magnetic fields to expand tracking volume and reduce conductive interference in instrument navigation.

Spacers inside a bent shield pipe hold wire position, limiting protrusion variation and preventing insulation breakdown during connection.

An inserted conductive protrusion grounds a wire harness shield inside the exterior cover, maintaining stable EMI shielding without exposing the shield.

A grounded conductive foundation and enclosure create localized EMI shielding for sensitive connector pin fields without major PCB redesign.

High-carbon, non-epoxy-sized carbon fibers in PBT improve EMI shielding and conductivity while preserving mechanical properties for radomes.

A grounded PCB foundation and enclosure shield connector pin fields from nearby EMI while avoiding extra shielding hardware.

A metal foil and conductive grounding member replace welded plated sheets to control unnecessary radiation with lower cost and simpler assembly.

A functional tape combines adhesion and EMI shielding around the driver IC, cutting bezel width, alignment error, and shielding cost.

Selective glue only at shielding tape overlaps keeps cable shielding stable while reducing high-frequency attenuation and insertion loss.

A screwed metallic thermal link improves heat transfer from shielded components while adapting to manufacturing tolerances.

A sharpened protruding electrode exposed through resin gives the shield film a stable electrical connection for consistent electromagnetic shielding.

Magnetic iron oxide resonance and permittivity control cut surface reflection while absorbing millimeter-wave radiation in a flexible transmission layer.

Magnetic closure and a shielded housing block relay-attack signals while inclined surfaces help position the smart key for one-hand use.

A zoned inverter housing uses a heat sink and aluminum shielding to separate power and control sections, improving thermal and EMI reliability.

A wound magnetic wrap keeps adjacent wires evenly spaced, reducing radiation noise emission and cross-wire interference in wire harnesses.

A magnetic shell protects the wound internal magnet during coil winding while boosting common-mode impedance for wider EMI filtering.