Connector Pin Field EMI Shielding Assembly for Localized PCB Protection

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Solution Overview

Problem

Printed Circuit Board Assemblies (PCBAs) face challenges in effectively shielding against Electromagnetic Interference (EMI) due to design constraints and the susceptibility of small, sensitive areas to interference from nearby radiating components, where traditional shielding methods are not feasible.

Innovation Solution

An Electromagnetic Interference Shielding Assembly (EISA) is provided, which includes an enclosure made of electromagnetic shielding material, securely connected to the PCBA to surround and contain the area of interest, utilizing a conductive foundation with mounting surfaces and metal traces connected to ground potential, effectively sealing the area within the enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional EMI shielding methods (covers, tapes, frames) are used to encapsulate radiating components, then EMI protection is improved, but device complexity and space requirements increase

Engineering Contradiction:

ImproveEMI protectionVSAvoidshielding structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The invention divides the shielding function into two segments: a conductive foundation integrated into the PCBA that provides base shielding, and a separate enclosure that provides additional shielding when needed. This segmentation allows flexible application of shielding only where required rather than enclosing entire radiating components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The enclosure is designed to shield only the specific small area of interest (such as connector pin fields) rather than the entire radiating component. The conductive foundation is strategically placed to provide local shielding at critical interfaces, implementing shielding quality locally where EMI susceptibility exists.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If full separation or encapsulation of EMI-radiating areas is implemented, then EMI protection is improved, but design flexibility and mounting options are reduced

Engineering Contradiction:

ImproveEMI protectionVSAvoiddesign flexibility

Core Design Contradiction:

Object-affected harmful factorsVSAdaptability or versatility

Solution Approach 1:

The shielding solution is made dynamic and adaptable through the modular enclosure design that can be selectively applied to different areas of interest on the PCBA. The enclosure can be positioned and configured based on specific EMI susceptibility locations rather than requiring fixed full encapsulation of radiating components.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The conductive foundation acts as an intermediary between the PCBA ground system and the enclosure, providing a flexible interface that adapts to different PCBA layouts and connector positions. This intermediary layer enables the enclosure to be selectively applied without requiring full encapsulation of radiating areas.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If the enclosure is securely connected to contact the conductive foundation, then EMI shielding effectiveness is improved, but manufacturing precision requirements increase

Engineering Contradiction:

ImproveEMI shielding effectivenessVSAvoidenclosure-to-PCBA alignment precision

Core Design Contradiction:

Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The enclosure is designed with flexible mounting capabilities that can accommodate variations in PCBA dimensions and conductor foundation positions. The secure connection mechanism allows for sufficient contact between the enclosure and conductive foundation without requiring extremely tight manufacturing tolerances, enabling effective EMI shielding while maintaining manufacturing feasibility.

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The EISA effectively shields the connector pin field from EMI, providing localized protection without requiring additional hardware or altering existing designs, and can be retrofitted to accommodate various connector sizes and shapes, ensuring reliable operation in critical applications.

Implementation Method 1

An Electromagnetic Interference (EMI) Shielding Assembly (EISA) for a Printed Circuit Board Assembly (PCBA) is provided and includes an enclosure, wherein the enclosure defines an enclosure cavity and an electrically conductive foundation associated with PCBA having an area of interest

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Implementation Method 2

the enclosure is securely connected to the PCBA to completely cover the area of interest and to contact the electrically conductive foundation

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20250007221A1Integrated scalable connector pin field EMI shielding assembly and a method for implementing same

Publication Date: 2025.01.02 HAMILTON SUNDSTRAND CORP

AI summary

An Electromagnetic Interference (EMI) Shielding Assembly (EISA) for a PCBA is provided and includes an enclosure, wherein the enclosure defines an enclosure cavity and an electrically conductive foundation associated with a PCBA having an area of interest, wherein the electrically conductive foundation at least partially surrounds the area of interest, and wherein the enclosure is securely connected to the PCBA to completely cover the area of interest and to contact the electrically conductive foundation.