Shielded Circuit Board Thermal Link for Tolerance-Aware Cooling

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Solution Overview

Problem

Existing heat dissipation solutions for electronic components covered with electromagnetic shielding, such as thermal foam, suffer from poor thermal conduction and manufacturing tolerance issues, leading to inefficient heat dissipation.

Innovation Solution

A metallic thermal connection part is screwed into a protective layer, allowing for adjustable contact with the electronic component to enhance thermal conduction and adapt to manufacturing tolerances while maintaining electromagnetic shielding integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If thermal foam is used to accommodate manufacturing tolerances, then adaptability to manufacturing variations is improved, but thermal conductivity deteriorates

Engineering Contradiction:

Improveadaptability to manufacturing tolerancesVSAvoidthermal conductivity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent introduces a metallic intermediary element (screw or rod) between the electronic component and the protective layer. This metallic intermediary serves as a thermal conductor while the compressible element (foam or elastomer) acts as a mediator to accommodate manufacturing tolerances. The metallic intermediary transfers heat efficiently from the component to the protective layer, while the compressible mediator ensures continuous contact despite dimensional variations.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution combines materials with different properties: a metallic material (high thermal conductivity) for heat transfer, and a compressible material (foam or elastomer) for tolerance accommodation. This composite approach allows the system to simultaneously achieve both thermal efficiency and adaptability to manufacturing variations.

Inventive Principle:

Principle #40Composite materials

2Reliability

If a metal part of predetermined dimensions is used for thermal connection, then thermal conductivity is improved, but adaptability to manufacturing tolerances deteriorates

Engineering Contradiction:

Improvethermal conductivityVSAvoidadaptability to manufacturing tolerances

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent transforms the static predetermined metal part into a dynamic adjustable structure. The metallic intermediary element can be adjusted in position or length to accommodate manufacturing tolerances. The compressible element introduces dynamic compliance to the thermal connection path, allowing the system to adapt to dimensional variations while maintaining thermal contact.

Inventive Principle:

Principle #15Dynamics

3Object-affected harmful factors

If the protective layer is positioned at a non-zero distance from the electronic component, then electromagnetic shielding is improved, but heat dissipation deteriorates

Engineering Contradiction:

Improveelectromagnetic shieldingVSAvoidheat dissipation

Core Design Contradiction:

Object-affected harmful factorsVSTemperature

Solution Approach 1:

The patent introduces metallic intermediary elements that bridge the gap between the electronic component and the protective layer. These intermediaries provide thermal conduction paths through the air gap, enabling heat dissipation while the protective layer remains positioned at a non-zero distance for electromagnetic shielding purposes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The solution segments the protective layer into multiple sections with thermal connection pieces distributed across the surface. This segmentation allows the protective layer to maintain its shielding function at a distance while multiple thermal pathways efficiently conduct heat from the component to the protective layer.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides improved heat dissipation efficiency for electronic components by leveraging better thermal conductivity and adjustable positioning, ensuring effective heat transfer without compromising the protective shielding.

Implementation Method 1

A metallic thermal connection part is screwed into a protective layer, allowing for adjustable contact with the electronic component to enhance thermal conduction

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4482272A1Electronic card equipped with a heat dissipation device and apparatus comprising such an electronic card

Publication Date: 2024.12.25 BULL SA

Figure 1a~2b
Figure 3~4b

AI summary

The invention relates to an electronic circuit board (200) comprising: - a support (102), - at least one electronic component (104) mounted on said support (102), - a protective layer (110) mounted on said support (102), covering said electronic component (104) at a non-zero distance from said electronic component (104), and - a heat dissipation device for said electronic component (104) comprising a metallic thermal link (202) screwed into said protective layer (110), passing through said protective layer (110) and coming into contact with said electronic component (104), so as to create a thermal link between said electronic component (104) and said protective layer (110). It also relates to an electronic device comprising such an electronic circuit board.