Layered Electromagnetic Wave Attenuator for Thin Low-Frequency Shielding

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Solution Overview

Problem

Existing electromagnetic wave attenuators struggle to effectively improve the attenuation characteristics of electromagnetic waves, particularly in both high and low frequency bands, while maintaining a thin thickness.

Innovation Solution

The electromagnetic wave attenuator is designed with a first structure body comprising multiple layers of magnetic and nonmagnetic materials, where the first magnetic layer is thicker and has higher crystallinity than the second magnetic layer, and the nonmagnetic layers are conductive, allowing for effective attenuation across various frequency bands.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the electromagnetic wave attenuator is increased to improve attenuation characteristics, then the attenuation effect is improved, but the thickness increases which is undesirable for downsizing electronic devices

Engineering Contradiction:
Improveattenuation characteristicsVSAvoidthickness
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent applies local quality by creating magnetic layers with different thicknesses and crystallinities in specific locations. The first magnetic layer has greater thickness and higher crystallinity than the second magnetic layer, allowing each layer to contribute differently to electromagnetic wave attenuation. This non-uniform structure optimizes attenuation characteristics without requiring uniform increase in overall thickness.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent uses composite materials by combining magnetic layers with different properties (thickness, crystallinity) and alternating them with nonmagnetic layers. This composite structure of multiple layers with varying characteristics achieves superior attenuation performance compared to a single uniform layer, allowing effective attenuation without proportionally increasing total thickness.

Inventive Principle:
Principle #40Composite materials

2Reliability

If multiple layers with different magnetic layer thicknesses are used to improve attenuation across frequency bands, then attenuation characteristics are improved, but the structural complexity increases

Engineering Contradiction:
Improveattenuation characteristicsVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the attenuator into multiple distinct layers: first magnetic layer, first nonmagnetic layer, second magnetic layer, and second nonmagnetic layer. Each segment has specific properties (the first magnetic layer has greater thickness and higher crystallinity than the second), allowing optimized attenuation across different frequency bands while maintaining a manageable segmented structure.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration achieves a higher attenuation effect and improved attenuation characteristics, particularly in the low frequency band, while maintaining a thin thickness, which is beneficial for downsizing electronic devices and increasing production efficiency.

Implementation Method 1

a first magnetic layer and a first nonmagnetic layer which are alternately provided in a first direction, a second magnetic layer and a second nonmagnetic layer which are alternately provided in a first direction

Methodology Applied
Scientific EffectMagnetic absorption: Magnetic Hysteresis

Implementation Method 2

The first nonmagnetic layer is conductive... The second nonmagnetic layer is conductive... The third nonmagnetic layer is conductive

Methodology Applied
Scientific EffectEddy current: Eddy Currents

Data Source

PatentUS12224250B2Electromagnetic wave attenuator, electronic device, film formation apparatus, and film formation method
Publication Date: 2025.02.11 SHIBAURA MECHATRONICS CORP
  • US12224250B2 patent drawing
  • US12224250B2 patent drawing
  • US12224250B2 patent drawing

AI summary

According to one embodiment, an electromagnetic wave attenuator includes a first structure body. The first structure body includes a first member, a second member, and a third member. The first member includes a first magnetic layer and a first nonmagnetic layer alternately provided in a first direction. The first nonmagnetic layer is conductive. The first direction is a stacking direction. The second member includes a second magnetic layer and a second nonmagnetic layer alternately provided in the first direction. The second nonmagnetic layer is conductive. The third member includes a third nonmagnetic layer. The third nonmagnetic layer is conductive. A direction from the third member toward the first member is along the first direction. A direction from the third member toward the second member is along the first direction. A first magnetic layer thickness is greater than a second magnetic layer thickness.