Shielded Inductor Module Layout for Low-Height Dense Mounting
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Solution Overview
Problem
Existing electronic component modules face challenges in reducing height while maintaining inductor element characteristics and achieving high-density component mounting, as a close proximity between inductor elements and electromagnetic shields degrades inductor performance.
Innovation Solution
The electronic component module design features a two-stage mounting configuration with a substrate, inductor element, sealing resin, and electromagnetic shield, where the inductor element has a helical conductor perpendicular to the substrate, and the second electronic component is positioned to increase the distance between the inductor and the shield, achieving high-density mounting without degrading inductor performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the height of the electronic component module is reduced, then the module size is decreased, but the distance between the inductor element and the electromagnetic wave shield becomes small causing inductor characteristics to degrade
Solution Approach 1:
The patent introduces a base portion extending from the substrate, creating a vertical dimension that positions the second electronic component (inductor element) at a greater distance from the electromagnetic wave shield. This dimensional extension allows the inductor to be mounted on the base portion rather than directly on the substrate, increasing the separation distance and reducing electromagnetic interference while maintaining compact overall module height.
2Productivity
If electronic components are mounted in a single layer, then the structure is simple, but the mounting density is low
Solution Approach 1:
The patent segments the mounting structure into multiple functional parts: a substrate, a base portion extending from the substrate, and multiple mounting locations at different vertical levels. This segmentation allows different electronic components to be mounted at different heights - ordinary components on the substrate and inductor elements on the elevated base portion - thereby achieving high-density three-dimensional mounting while maintaining structural clarity and manufacturing feasibility.
Data Source
AI summary
An electronic component module that includes a substrate, an inductor element, a single-sided functional component, a sealing resin, and an electromagnetic shield. The inductor element is mounted on the substrate. The single-sided functional component is mounted on a base ground conductor and a base signal conductor that are disposed on a side of the inductor element opposite to the substrate. The sealing resin has an insulating property and covers the inductor element, the base ground conductor, the base signal conductor, and the single-sided functional component. The electromagnetic shield covers the sealing resin, and a ground surface of the single-sided functional component.