Magnetic Shielding Element Layout for Compact Electronic Assemblies
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Solution Overview
Problem
Conventional electronic devices face challenges with magnetic interference due to compact component arrangements, leading to increased manufacturing complexity, higher costs, and reduced heat dissipation efficiency.
Innovation Solution
The use of a magnetic shielding element with a magnetic shielding layer and insulation films, strategically placed between electronic components to reduce magnetic interference, while also enhancing insulation efficiency and allowing for flexible assembly and reduced costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If copper plates are used to reduce magnetic interference, then magnetic interference is reduced, but device volume increases and manufacturing complexity increases
Solution Approach 1:
The patent replaces rigid copper plates with flexible magnetic shielding films that can be conformally applied to component surfaces. These thin films provide effective magnetic shielding while occupying minimal space, directly resolving the contradiction between magnetic interference reduction and device volume reduction.
Solution Approach 2:
The patent employs cost-effective magnetic shielding materials such as ferrite beads, magnetic tapes, or thin ferrite sheets instead of expensive copper plates. These simpler materials achieve adequate magnetic shielding performance at lower cost and with reduced volume, addressing both the harmful factor reduction and volume constraints.
2Object-affected harmful factors
If copper plates are used to reduce magnetic interference, then magnetic interference is reduced, but manufacturing complexity increases
Solution Approach 1:
Flexible magnetic shielding films can be directly wrapped around or adhered to components using simple bonding methods, eliminating the need for precise machining, grounding connections, or complex assembly procedures required by copper plates. This dramatically simplifies the manufacturing process while maintaining shielding effectiveness.
Solution Approach 2:
The use of simple magnetic shielding elements like ferrite beads or tapes that can be manually or automatically applied without complex tooling or grounding infrastructure reduces manufacturing complexity. These materials are easier to handle and install compared to rigid copper plates requiring precise positioning and electrical connections.
3Object-affected harmful factors
If openings are made in casing to reduce magnetic reflection, then magnetic reflection is reduced, but heat dissipation efficiency decreases
Solution Approach 1:
The patent extracts the magnetic shielding function from the structural casing by applying dedicated magnetic shielding films or elements to component surfaces. This allows the casing to remain intact with full heat dissipation capability while magnetic shielding is provided separately, eliminating the need to compromise casing integrity with openings.
Solution Approach 2:
The patent introduces magnetic shielding films as intermediary layers between magnetic components and the surrounding environment or casing. These films provide magnetic reflection protection without requiring modifications to the casing structure, thus preserving heat dissipation pathways while reducing magnetic reflection.
4Object-affected harmful factors
If openings are made in casing to reduce magnetic reflection, then magnetic reflection is reduced, but manufacturing cost increases
Solution Approach 1:
By separating the magnetic shielding function from the casing structure and applying it directly to components via adhesive films or attached elements, the patent eliminates the need for expensive precision opening operations, tooling, and assembly steps. This approach uses simpler, lower-cost materials and processes while achieving the same magnetic reflection reduction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces magnetic interference, simplifies assembly, lowers costs, and improves heat dissipation efficiency, while meeting the requirements of miniaturization.
Implementation Method 1
at least a part of the magnetic shielding element is disposed between the first component and the second component
Implementation Method 2
The magnetic shielding element includes a magnetic shielding layer and at least one insulation film
Data Source
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AI summary
The present disclosure provides an electronic device (100, 101, 102, 103) and a magnetic shielding element (3, 3a, 3b) thereof. The electronic device (100, 101, 102, 103) includes a first component (1), a second component (2) and a magnetic shielding element (3, 3a, 3b). The first component (1) is an electronic component. The second component (2) disposed adjacent to the first component (1). At least a part of the magnetic shielding element (3, 3a, 3b) is disposed between the first component (1) and the second component (2). Consequently, the advantage of reducing the magnetic interference is achieved.