Shielded Module Assembly With Exposed Protruding Electrode Contact
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Solution Overview
Problem
The existing method of forming an electromagnetic shield, as disclosed in Japanese Patent Laid-Open No. 2003-318592, results in an unstable electrical connection due to the fractured surface of the metal layer coming into contact with the ground connection terminal, leading to unstable shielding performance.
Innovation Solution
A module is designed with a substrate, a component mounted on its surface, a protruding electrode with a sharpened portion exposed from a resin film, and a shield film electrically connected to the electrode, ensuring a stable electrical connection and shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the metal layer is formed on the insulating layer and vacuumed to bring into close contact with the printed circuit board, then the shield pack can be assembled, but the metal layer becomes exposed and the connection becomes unstable
Solution Approach 1:
The design extracts and exposes only the necessary portion of the metal layer's inner surface by having the ground connection terminal penetrate through the insulating layer. This selective exposure ensures stable electrical connection without requiring the entire metal layer to be exposed, maintaining manufacturing ease while improving connection reliability.
Solution Approach 2:
The shield pack structure applies local quality by differentiating the exposure status of the metal layer: the inner surface is locally exposed where the ground connection terminal contacts it, while the outer surface remains covered by the insulating layer. This localized exposure strategy ensures stable electrical connection at the contact point without compromising overall structural integrity or manufacturing simplicity.
Data Source
AI summary
A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.